Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to folding the sheet metal in opposite directions at various intervals to form outer and inner folds. By arranging the fins in a non-prismatic radial pattern around the central core, airflow generated by an overhead fan is better utilized, thus improving the cooling effect of the device.