Patents by Inventor Daniel P. DeSantis

Daniel P. DeSantis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8323549
    Abstract: A method for forming temporary protective coatings and bondable surfaces is disclosed. In the method, a soluble layer is disposed on a material surface, such as the interior surfaces of cell walls of a web material. The soluble material is then removed or leached from the web material to form and expose a roughly textured, bondable surface for bonding with another material, such as AVCOAT insulation. Use of the soluble layer, therefore, enhances the bondability of any surface that requires good adhesion, such as where the surface is difficult to reach for conventional surface preparation techniques.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: December 4, 2012
    Assignee: Textron Systems Corporation
    Inventors: Raymond C. Loszewski, Daniel P. DeSantis
  • Publication number: 20100124660
    Abstract: A method for forming temporary protective coatings and bondable surfaces is disclosed. In the method, a soluble layer is disposed on a material surface, such as the interior surfaces of cell walls of a web material. The soluble material is then removed or leached from the web material to form and expose a roughly textured, bondable surface for bonding with another material, such as AVCOAT insulation. Use of the soluble layer, therefore, enhances the bondability of any surface that requires good adhesion, such as where the surface is difficult to reach for conventional surface preparation techniques.
    Type: Application
    Filed: November 16, 2009
    Publication date: May 20, 2010
    Applicant: TEXTRON SYSTEMS CORPORATION
    Inventors: Raymond C. Loszewski, Daniel P. DeSantis
  • Publication number: 20090202780
    Abstract: Formation of a filled honeycomb structure by interleaving layers of material and pre-formed pins made of a desired filler material is disclosed. In one embodiment, the material layers may be pre-impregnated and the pre-formed pins may be made of a foam, insulating material. The fabric layers and the pre-formed elongated foam members are assembled in an interleaved manner to form a raw assembly, and heat is applied to activate the resin and cure the raw assembly. The technique further involves allowing the raw assembly to cool to form a unitary, integral honeycomb structure.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 13, 2009
    Applicant: TEXTRON SYSTEMS CORPORATION
    Inventors: Raymond C. Loszewski, Daniel P. DeSantis