Patents by Inventor Daniel P. SIMCO

Daniel P. SIMCO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a cooled electronic system
    Patent number: 8649177
    Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: February 11, 2014
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark D. Schultz, Daniel P. Simco, Mark E. Steinke
  • Cooled electronic system with thermal spreaders coupling electronics cards to cold rails
    Patent number: 8493738
    Abstract: Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: July 23, 2013
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes, David P. Graybill, Madhusudan K. Iyengar, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt, Mark D. Schultz, Daniel P. Simco, Mark E. Steinke
  • COOLED ELECTRONIC SYSTEM WITH THERMAL SPREADERS COUPLING ELECTRONICS CARDS TO COLD RAILS
    Publication number: 20120281358
    Abstract: Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 8, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. CHAINER, Michael A. GAYNES, David P. GRAYBILL, Madhusudan K. IYENGAR, Vinod KAMATH, Bejoy J. KOCHUPARAMBIL, Roger R. SCHMIDT, Mark D. SCHULTZ, Daniel P. SIMCO, Mark E. STEINKE
  • METHOD OF FABRICATING A COOLED ELECTRONIC SYSTEM
    Publication number: 20120279047
    Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
    Type: Application
    Filed: April 20, 2012
    Publication date: November 8, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. CHAINER, Michael A. GAYNES, David P. GRAYBILL, Madhusudan K. IYENGAR, Vinod KAMATH, Bejoy J. KOCHUPARAMBIL, Roger R. SCHMIDT, Mark D. SCHULTZ, Daniel P. SIMCO, Mark E. STEINKE