Patents by Inventor Daniel P. Tracy

Daniel P. Tracy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for attaching a lead frame to a heat spreader/heat slug structure
    Patent number: 6479323
    Abstract: A method and structure for attaching a lead frame to a heat sink are provided. In one embodiment, a layer of thermally conductive, electrically insulating epoxy is formed on a heat sink and the epoxy layer is fully cured. A thermoplastic adhesive layer is formed on the epoxy layer, and the heat sink is clamped to the lead frame such that the thermoplastic layer contacts the lead frame. The thermoplastic layer is heated to its melting point and then cooled, thereby joining the heat sink and the lead frame. In a variation, a partially cured B-stage epoxy layer is used to replace the thermoplastic layer. The B-stage epoxy layer is fully cured to connect the lead frame to the heat sink.
    Type: Grant
    Filed: July 10, 1997
    Date of Patent: November 12, 2002
    Assignee: National Semiconductor Corporation
    Inventors: Randy H. Y. Lo, Boonmi Mekdhanasarn, Daniel P. Tracy
  • Structure for attaching a lead frame to a heat spreader/heat slug structure
    Patent number: 5691567
    Abstract: A method and structure for attaching a lead frame to a heat sink are provided. In one embodiment, a layer of thermally conductive, electrically insulating epoxy is formed on a heat sink and the epoxy layer is fully cured. A thermoplastic adhesive layer is formed on the epoxy layer, and the heat sink is clamped to the lead frame such that the thermoplastic layer contacts the lead frame. The thermoplastic layer is heated to its melting point and then cooled, thereby joining the heat sink and the lead frame. In a variation, a partially cured B-stage epoxy layer is used to replace the thermoplastic layer. The B-stage epoxy layer is fully cured to connect the lead frame to the heat sink.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: November 25, 1997
    Assignee: National Semiconductor Corporation
    Inventors: Randy H. Y. Lo, Boonmi Mekdhanasarn, Daniel P. Tracy