Patents by Inventor Daniel P. Willis

Daniel P. Willis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS
    Publication number: 20230220219
    Abstract: Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 13, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Liang Ma, Marvin M. Pollum, Jr., Masayuki Nakajima, Daniel P. Willis, Lorraine Hsu, Allison G. Condie, Maria S. French, Hongying Zhou, Qi Zheng, Hong Li, Calum H. Munro