Abstract: A connection apparatus and associated method. The apparatus comprises a space transformer assembly and a leveling apparatus. The space transformer is adapted to electrically connect a testing apparatus to a semiconductor device through an interface board. The leveling apparatus is adapted to apply varying amounts of force to a plurality of sections of the interface substrate. The varying amounts of force are adapted to generate pressure on the plurality of sections of the interface substrate and form electrical connections between contacts on the interface substrate and all contacts on the semiconductor device.