Patents by Inventor Daniel POUNDS

Daniel POUNDS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lightweight structurally and thermally efficient oscillating heat pipe panel
    Patent number: 11781815
    Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: October 10, 2023
    Assignee: ThermAvant Technologies, LLC
    Inventors: Benjamin Alexander, Daniel Pounds, Joshua Schorp, Bruce Drolen, Corey Wilson, Joseph Boswell
  • LIGHTWEIGHT STRUCTURALLY AND THERMALLY EFFICIENT OSCILLATING HEAT PIPE PANEL
    Publication number: 20220074674
    Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Inventors: Benjamin ALEXANDER, Daniel POUNDS, Joshua SCHORP, Bruce DROLEN, Corey WILSON, Joseph BOSWELL