Patents by Inventor Daniel R. Bellus

Daniel R. Bellus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for wire bonding an aluminum wire to a lead of an electronics package
    Patent number: 5492263
    Abstract: A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: February 20, 1996
    Assignee: Delco Electronics Corp.
    Inventors: Mark E. Webster, John A. Hearn, Daniel R. Bellus, Steven M. Stansberry, Steven A. Middleton, Ronald D. Myer, Gregory L. Hall