Patents by Inventor Daniel R. Miga

Daniel R. Miga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit and interconnect, and method of fabricating same
    Patent number: 9390969
    Abstract: The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance inductors. The IC includes at least one trench within a dielectric layer disposed on a substrate. The trench is conformally coated with a liner and seed layer, and includes an interconnect within. The interconnect includes a hard mask on the sidewalls of the interconnect.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: July 12, 2016
    Assignee: GlobalFoundries, Inc.
    Inventors: David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Daniel S. Vanslette, Eric J. White
  • INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME
    Publication number: 20150140809
    Abstract: The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance inductors. The IC includes at least one trench within a dielectric layer disposed on a substrate. The trench is conformally coated with a liner and seed layer, and includes an interconnect within. The interconnect includes a hard mask on the sidewalls of the interconnect.
    Type: Application
    Filed: January 20, 2015
    Publication date: May 21, 2015
    Inventors: David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Daniel S. Vanslette, Eric J. White
  • Semiconductor structure
    Patent number: 8796058
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: August 5, 2014
    Assignee: International Business Machines Corporation
    Inventors: Russell T. Herrin, Daniel R. Miga, Anthony K. Stamper
  • SEMICONDUCTOR STRUCTURE
    Publication number: 20130105920
    Abstract: Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.
    Type: Application
    Filed: November 2, 2011
    Publication date: May 2, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Russell T. HERRIN, Daniel R. MIGA, Anthony K. STAMPER
  • INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME
    Publication number: 20120086101
    Abstract: The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance inductors. The IC includes at least one trench within a dielectric layer disposed on a substrate. The trench is conformally coated with a liner and seed layer, and includes an interconnect within. The interconnect includes a hard mask on the sidewalls of the interconnect.
    Type: Application
    Filed: October 6, 2010
    Publication date: April 12, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Daniel S. Vanslette, Eric J. White