Abstract: An integrated sample return capsule for use in returning materials to Earth from space, such as core samples from other celestial bodies and experiments from orbiting platforms. The sample return capsule incorporates thermal protection, structural integrity and impact mitigation into a single system capable of safely and securely returning the materials without requiring decelerating parachutes. In one embodiment, the integrated sample return capsule includes a forward facing heat shield and a back shell attached to the rear of the heat shield. The heat shield and the back shell define an interior enclosure. The back shell includes an access, such as a door or a removable panel, there through to the interior enclosure. Materials to be returned may be sealed in a sample containment vault, and the sealed vault may be placed into the interior enclosure through the access.

Abstract: A method and system for making monolithically integrated thin film photovoltaic is disclosed. In one embodiment of the system, a device for directing electromagnetic energy having a selected frequency is utilized to electronically excite a portion of a second medium on the surface of a substrate to facilitate reaction with an excitable deposition medium. The frequency may be selected such that the desired reaction between the excited second medium and deposition medium is facilitated and side reactions and incorporation of impurities into the thin film are minimized. Multiple layers may be formed by selecting additional frequencies, if necessary. The method of the present invention allows formation of monolithically integrated thin films without removing material from the substrate surface between deposition steps.

Abstract: A vibration attenuation system (10) is disclosed for at least partially isolating a structure (16) from a vibrating source (14). The system (10) generally includes a differential stiffness assembly (12) interposed between the vibration source (14) and the structure (16), a vibration sensor (18) for sensing a vibration from the source (14), a controller (20) for controlling operation of the differential stiffness assembly (12) based on a sensed vibration from the source (14), and an actuator for varying a load applied to the differential stiffness assembly (12) in response to control signals from the controller (20). The differential stiffness assembly (12) includes an element such as a metallic tube (30), that provides a variable frequency-related vibration transmission/attenuation response depending on a load applied to the member. In one embodiment, a shape memory alloy wire (28) is interconnected to the tube (30) to apply a varying load to the tube (30) depending on a temperature of the wire (28).

Abstract: The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.

Abstract: An electrical socket used for interconnecting a multichip module to a printed circuit board or similar electrical system. The electrical socket is independent of the multichip module and permits removal and replacement of the multichip module without damaging the module and its module electrical leads. The socket includes an insulated base strip and an insulated cap strip. The base strip includes a plurality of elongated lower pockets therein for receiving and properly aligning each of the module electrical leads therein. The base strip also includes conductive pads in the bottom of and along the length of each pocket. Each conductive pad is connected to a socket lead. The socket leads are used for connection to the printed circuit board or like electrical system. The cap strip includes a plurality of elongated upper pockets therein which are dimensioned for receipt above the lower pockets of the base strip.