Patents by Inventor Daniel Ray Ash, Jr.

Daniel Ray Ash, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Durable laminated electronics assembly using epoxy preform
    Patent number: 6421253
    Abstract: A delamination resistant electronics module assembly includes a printed circuit board layer coupled to a pallet via a cured epoxy preform. The preform may include conductive epoxy, or non-conductive epoxy with conductive traces. Component wells are collectively formed by the preform and PCB layer for placement of heat generating components, such as RF components. Methods of manufacturing module assemblies include curing the epoxy preform by applying a predetermined elevated pressure and heat to a sub-assembly of the pallet, preform layer, and PCB layer.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: July 16, 2002
    Assignee: Powerwave Technologies, Inc.
    Inventor: Daniel Ray Ash, Jr.