Patents by Inventor Daniel Redfield
Daniel Redfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964359Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.Type: GrantFiled: October 23, 2019Date of Patent: April 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Ashwin Chockalingham, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield
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Patent number: 11965103Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.Type: GrantFiled: August 18, 2020Date of Patent: April 23, 2024Assignee: Applied Materials, Inc.Inventors: Yingdong Luo, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Daihua Zhang, Uma Sridhar, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
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Publication number: 20240123568Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and methods of manufacturing the same. According to one or more embodiments, a method for forming or otherwise preparing a polishing article by sequentially forming a plurality of polymer layers is provided and includes: (a) dispensing a plurality of droplets of a polymer precursor composition onto a surface of a previously formed at least partially cured polymer layer, where the polymer precursor composition contains a first precursor component containing an epoxide group and a photoinitiator component which generates a photoacid when exposed to UV light, (b) at least partially curing the plurality of droplets to form an at least partially cured polymer layer, and (c) repeating (a) and (b).Type: ApplicationFiled: June 21, 2023Publication date: April 18, 2024Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
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Patent number: 11958162Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 17, 2020Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Patent number: 11911870Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater. A storage modulus (E?) of the cured pre-polymer composition at a temperature of 80° C. (E?80) can be about 200 MPa or greater.Type: GrantFiled: September 10, 2021Date of Patent: February 27, 2024Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Rajeev Bajaj, Yingdong Luo, Aniruddh Jagdish Khanna, You Wang, Daniel Redfield
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Patent number: 11878389Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.Type: GrantFiled: February 10, 2021Date of Patent: January 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Puneet Narendra Jawali, Veera Raghava Reddy Kakireddy, Rajeev Bajaj, Daniel Redfield
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Patent number: 11851570Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.Type: GrantFiled: October 30, 2019Date of Patent: December 26, 2023Assignee: Applied Materials, Inc.Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Chockalingam, Yingdong Luo, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
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Patent number: 11826876Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.Type: GrantFiled: April 4, 2019Date of Patent: November 28, 2023Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Ankit Vora, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
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Publication number: 20230330805Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.Type: ApplicationFiled: April 24, 2023Publication date: October 19, 2023Applicant: Applied Materials, Inc.Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
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Patent number: 11772229Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: GrantFiled: March 11, 2019Date of Patent: October 3, 2023Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
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Publication number: 20230294239Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.Type: ApplicationFiled: May 25, 2023Publication date: September 21, 2023Inventors: Sivapackia GANAPATHIAPPAN, Ankit VORA, Boyi FU, Venkat HARIHARAN, Mayu YAMAMURA, Mario CORNEJO, Igor ABRAMSON, Mo YANG, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA
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Patent number: 11745302Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: GrantFiled: March 22, 2021Date of Patent: September 5, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
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Publication number: 20230256567Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.Type: ApplicationFiled: April 24, 2023Publication date: August 17, 2023Inventors: Daniel Redfield, Jason Garcheung Fung, Mayu Felicia Yamamura
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Publication number: 20230256560Abstract: A method of forming a polishing pad that has a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.Type: ApplicationFiled: April 21, 2023Publication date: August 17, 2023Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Rajeev Bajaj, Daniel Redfield, Mayu Felicia Yamamura, Yingdong Luo, Nag B. Patibandla
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Patent number: 11724362Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: December 8, 2020Date of Patent: August 15, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Jagdish Khanna, Jason G. Fung, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Gregory E. Menk, Nag B. Patibandla
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Publication number: 20230219190Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.Type: ApplicationFiled: March 21, 2023Publication date: July 13, 2023Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Mayu Felicia Yamamura, Daniel Redfield, Rajeev Bajaj, Yingdong Luo, Nag B. Patibandla
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Publication number: 20230219189Abstract: Apparatus and methods for correcting asymmetry in a thickness profile by use of a Chemical Mechanical Planarization (CMP) process. In one embodiment, a CMP system includes a polishing pad, an adhesion layer, and a platen. The polishing pad includes has a polishing surface, a second surface that is positioned opposite to the polishing surface in a first direction, and a plurality of cavities formed in the second surface. The platen includes a body that comprises a pad supporting surface and one or more ports formed in the body, configured to receive a positive or negative pressure that is generated from a fluid control device. Each of the plurality of cavities is in fluid communication with at least one of the one or more ports and the adhesion layer is disposed between the pad supporting surface of the platen and a portion of the second surface of the polishing pad.Type: ApplicationFiled: January 7, 2022Publication date: July 13, 2023Inventors: Ashwin CHOCKALINGAM, Joshua CHEN, Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE, Daniel REDFIELD
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Patent number: 11685014Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.Type: GrantFiled: August 2, 2019Date of Patent: June 27, 2023Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Ankit Vora, Boyi Fu, Venkat Hariharan, Mayu Yamamura, Mario Cornejo, Igor Abramson, Mo Yang, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla
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Patent number: 11642757Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.Type: GrantFiled: December 29, 2020Date of Patent: May 9, 2023Assignee: Applied Materials, Inc.Inventors: Daniel Redfield, Jason Garcheung Fung, Mayu Felicia Yamamura
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Patent number: 11638979Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.Type: GrantFiled: June 9, 2020Date of Patent: May 2, 2023Assignee: Applied Materials, Inc.Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Rajeev Bajaj, Daniel Redfield, Mayu Felicia Yamamura, Yingdong Luo, Nag B. Patibandla