Patents by Inventor Daniel Rich
Daniel Rich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240099765Abstract: An electrosurgical forceps includes a first shaft member including a first inner frame. A first jaw member extends distally from the first inner frame. A first outer housing is supported by the first inner frame. The first inner frame includes a first member stamped from sheet metal. A second shaft member includes a second inner frame. A second jaw member extends distally from the second inner frame. A second outer housing is supported by the second inner frame. The second inner frame includes a second member stamped from sheet metal and a rigid filler member disposed on the second member.Type: ApplicationFiled: December 1, 2023Publication date: March 28, 2024Inventors: Kelley Goodman, Grant T. Sims, Daniel W. Mercier, Craig Krastins, Jennifer Rich
-
Patent number: 11450488Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: GrantFiled: May 31, 2019Date of Patent: September 20, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
-
Patent number: 11441855Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: GrantFiled: August 19, 2021Date of Patent: September 13, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
-
Patent number: 11410820Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: GrantFiled: May 31, 2019Date of Patent: August 9, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
-
Patent number: 11326843Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: GrantFiled: February 2, 2021Date of Patent: May 10, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
-
Publication number: 20210389062Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: ApplicationFiled: August 19, 2021Publication date: December 16, 2021Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
-
Publication number: 20210265234Abstract: Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.Type: ApplicationFiled: May 10, 2021Publication date: August 26, 2021Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
-
Publication number: 20210254910Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: ApplicationFiled: February 2, 2021Publication date: August 19, 2021Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
-
Publication number: 20200227211Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: ApplicationFiled: March 24, 2020Publication date: July 16, 2020Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
-
Patent number: 10600582Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: GrantFiled: November 12, 2019Date of Patent: March 24, 2020Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
-
Publication number: 20200082997Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: ApplicationFiled: November 12, 2019Publication date: March 12, 2020Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
-
Publication number: 20190371534Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: ApplicationFiled: May 31, 2019Publication date: December 5, 2019Applicant: FastCAP SYSTEMS CorporationInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
-
Publication number: 20130330161Abstract: A locking mechanism adapted for use with a lift arm assembly. The lift arm assembly is connected to and operatively associated with a lift actuator for movement between raised and lowered positions. The lift actuator having a tubular body and an extendable rod. The locking mechanism includes a lockbar having a proximal end and a distal end opposite to the proximal end. The proximal end is configured to be pivotally connected to the lift arm assembly and movable between an inoperative position and an operative position to selectively prevent retraction of the rod within the tubular body of the lift actuator. The locking mechanism further includes a release lever pivotally connected at the distal end of the lockbar and is adapted to move between a rest position and a working position.Type: ApplicationFiled: June 8, 2012Publication date: December 12, 2013Applicant: Caterpillar SARL LLCInventor: Daniel A. Rich
-
Patent number: 7127596Abstract: Embodiments of the invention provide for automatically resolving computer system boot-up problems and for ensuring the reliability of boot-up. According to embodiments, a test of a condition of a computer system may be performed prior to attempting to load an operating system, to ensure the reliability of the system. In other embodiments, a boot-up may be attempted from a plurality of different operating system images, in the event a boot-up from a given operating system image fails.Type: GrantFiled: June 28, 2002Date of Patent: October 24, 2006Assignee: Intel CorporationInventors: Daniel A. Rich, Robert L. Huff
-
Patent number: 7003659Abstract: A method for booting a computer. The method includes initiating a timer for a load and boot process. The load and boot process is monitored. Monitoring includes determined whether or not the load and boot process is completed successfully. Upon substantial completion of the load and boot process, the time is deactivated. The computer may be reset or sent into a system management mode of operation if the timer expires prior to completion of the load and boot process.Type: GrantFiled: April 29, 2002Date of Patent: February 21, 2006Assignee: Intel CorporationInventors: Daniel A. Rich, Robert L. Huff
-
Patent number: 6785806Abstract: A BIOS having a set of effectors to initialize harware within the system. The BIOS having a set of macros, each macro of the set of macros having a reference to an effector of the set of effectors, each macro of the set of macros having a set of arguments.Type: GrantFiled: February 29, 2000Date of Patent: August 31, 2004Assignee: Intel CorporationInventors: Joseph A. Schaefer, Michael F. Kartoz, Robert L. Huff, Kimberly A. Davis, Kirk Brannock, Donald Hewett, Daniel A. Rich, William J. Chalmers
-
Patent number: 6732261Abstract: In one embodiment, the invention is a method. The method includes receiving expected values of a configuration. The method also includes comparing the expected values with values of a configuration database. Furthermore, the method includes reporting results of the comparing.Type: GrantFiled: December 30, 1999Date of Patent: May 4, 2004Assignee: Intel CorporationInventors: William J. Chalmers, Joseph A. Schaefer, Kimberly A. Davis, Don G. Craven, Daniel A. Rich
-
Publication number: 20040003222Abstract: Embodiments of the invention provide for automatically resolving computer system boot-up problems and for ensuring the reliability of boot-up. According to embodiments, a test of a condition of a computer system may be performed prior to attempting to load an operating system, to ensure the reliability of the system. In other embodiments, a boot-up may be attempted from a plurality of different operating system images, in the event a boot-up from a given operating system image fails.Type: ApplicationFiled: June 28, 2002Publication date: January 1, 2004Inventors: Daniel A. Rich, Robert L. Huff
-
Publication number: 20030204709Abstract: Numerous embodiments of a method and apparatus for reliably booting a computing system are disclosed.Type: ApplicationFiled: April 29, 2002Publication date: October 30, 2003Inventors: Daniel A. Rich, Robert L. Huff
-
Publication number: 20030182545Abstract: In one embodiment, the invention is a method. The method includes receiving expected values of a configuration. The method also includes comparing the expected values with values of a configuration database. Furthermore, the method includes reporting results of the comparing.Type: ApplicationFiled: December 30, 1999Publication date: September 25, 2003Inventors: WILLIAM J. CHALMERS, JOSEPH A. SCHAEFER, KIMBERLY A. DAVIS, DON G. CRAVEN, DANIEL A. RICH