Patents by Inventor Daniel Rich

Daniel Rich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240099765
    Abstract: An electrosurgical forceps includes a first shaft member including a first inner frame. A first jaw member extends distally from the first inner frame. A first outer housing is supported by the first inner frame. The first inner frame includes a first member stamped from sheet metal. A second shaft member includes a second inner frame. A second jaw member extends distally from the second inner frame. A second outer housing is supported by the second inner frame. The second inner frame includes a second member stamped from sheet metal and a rigid filler member disposed on the second member.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Kelley Goodman, Grant T. Sims, Daniel W. Mercier, Craig Krastins, Jennifer Rich
  • Patent number: 11450488
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: September 20, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 11441855
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: September 13, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Patent number: 11410820
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: August 9, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 11326843
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: May 10, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210389062
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 16, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210265234
    Abstract: Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210254910
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 19, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20200227211
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 16, 2020
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 10600582
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: March 24, 2020
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Publication number: 20200082997
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 12, 2020
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Publication number: 20190371534
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Application
    Filed: May 31, 2019
    Publication date: December 5, 2019
    Applicant: FastCAP SYSTEMS Corporation
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Publication number: 20130330161
    Abstract: A locking mechanism adapted for use with a lift arm assembly. The lift arm assembly is connected to and operatively associated with a lift actuator for movement between raised and lowered positions. The lift actuator having a tubular body and an extendable rod. The locking mechanism includes a lockbar having a proximal end and a distal end opposite to the proximal end. The proximal end is configured to be pivotally connected to the lift arm assembly and movable between an inoperative position and an operative position to selectively prevent retraction of the rod within the tubular body of the lift actuator. The locking mechanism further includes a release lever pivotally connected at the distal end of the lockbar and is adapted to move between a rest position and a working position.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 12, 2013
    Applicant: Caterpillar SARL LLC
    Inventor: Daniel A. Rich
  • Patent number: 7127596
    Abstract: Embodiments of the invention provide for automatically resolving computer system boot-up problems and for ensuring the reliability of boot-up. According to embodiments, a test of a condition of a computer system may be performed prior to attempting to load an operating system, to ensure the reliability of the system. In other embodiments, a boot-up may be attempted from a plurality of different operating system images, in the event a boot-up from a given operating system image fails.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: October 24, 2006
    Assignee: Intel Corporation
    Inventors: Daniel A. Rich, Robert L. Huff
  • Patent number: 7003659
    Abstract: A method for booting a computer. The method includes initiating a timer for a load and boot process. The load and boot process is monitored. Monitoring includes determined whether or not the load and boot process is completed successfully. Upon substantial completion of the load and boot process, the time is deactivated. The computer may be reset or sent into a system management mode of operation if the timer expires prior to completion of the load and boot process.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: February 21, 2006
    Assignee: Intel Corporation
    Inventors: Daniel A. Rich, Robert L. Huff
  • Patent number: 6785806
    Abstract: A BIOS having a set of effectors to initialize harware within the system. The BIOS having a set of macros, each macro of the set of macros having a reference to an effector of the set of effectors, each macro of the set of macros having a set of arguments.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: August 31, 2004
    Assignee: Intel Corporation
    Inventors: Joseph A. Schaefer, Michael F. Kartoz, Robert L. Huff, Kimberly A. Davis, Kirk Brannock, Donald Hewett, Daniel A. Rich, William J. Chalmers
  • Patent number: 6732261
    Abstract: In one embodiment, the invention is a method. The method includes receiving expected values of a configuration. The method also includes comparing the expected values with values of a configuration database. Furthermore, the method includes reporting results of the comparing.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: May 4, 2004
    Assignee: Intel Corporation
    Inventors: William J. Chalmers, Joseph A. Schaefer, Kimberly A. Davis, Don G. Craven, Daniel A. Rich
  • Publication number: 20040003222
    Abstract: Embodiments of the invention provide for automatically resolving computer system boot-up problems and for ensuring the reliability of boot-up. According to embodiments, a test of a condition of a computer system may be performed prior to attempting to load an operating system, to ensure the reliability of the system. In other embodiments, a boot-up may be attempted from a plurality of different operating system images, in the event a boot-up from a given operating system image fails.
    Type: Application
    Filed: June 28, 2002
    Publication date: January 1, 2004
    Inventors: Daniel A. Rich, Robert L. Huff
  • Publication number: 20030204709
    Abstract: Numerous embodiments of a method and apparatus for reliably booting a computing system are disclosed.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 30, 2003
    Inventors: Daniel A. Rich, Robert L. Huff
  • Publication number: 20030182545
    Abstract: In one embodiment, the invention is a method. The method includes receiving expected values of a configuration. The method also includes comparing the expected values with values of a configuration database. Furthermore, the method includes reporting results of the comparing.
    Type: Application
    Filed: December 30, 1999
    Publication date: September 25, 2003
    Inventors: WILLIAM J. CHALMERS, JOSEPH A. SCHAEFER, KIMBERLY A. DAVIS, DON G. CRAVEN, DANIEL A. RICH