Patents by Inventor Daniel Rich
Daniel Rich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250379004Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: ApplicationFiled: August 14, 2025Publication date: December 11, 2025Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Patent number: 12406815Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: GrantFiled: March 24, 2020Date of Patent: September 2, 2025Assignee: NANORAMIC, INC.Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Patent number: 12130095Abstract: Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.Type: GrantFiled: May 10, 2021Date of Patent: October 29, 2024Assignee: Henkel AG & Co. KGaAInventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
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Patent number: 11450488Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: GrantFiled: May 31, 2019Date of Patent: September 20, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Patent number: 11441855Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: GrantFiled: August 19, 2021Date of Patent: September 13, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
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Patent number: 11410820Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: GrantFiled: May 31, 2019Date of Patent: August 9, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Patent number: 11326843Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: GrantFiled: February 2, 2021Date of Patent: May 10, 2022Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
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Publication number: 20210389062Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: ApplicationFiled: August 19, 2021Publication date: December 16, 2021Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
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Publication number: 20210265234Abstract: Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.Type: ApplicationFiled: May 10, 2021Publication date: August 26, 2021Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
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Publication number: 20210254910Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.Type: ApplicationFiled: February 2, 2021Publication date: August 19, 2021Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
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Publication number: 20200227211Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: ApplicationFiled: March 24, 2020Publication date: July 16, 2020Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Patent number: 10600582Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: GrantFiled: November 12, 2019Date of Patent: March 24, 2020Assignee: FASTCAP SYSTEMS CORPORATIONInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Publication number: 20200082997Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: ApplicationFiled: November 12, 2019Publication date: March 12, 2020Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Publication number: 20190371534Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.Type: ApplicationFiled: May 31, 2019Publication date: December 5, 2019Applicant: FastCAP SYSTEMS CorporationInventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
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Patent number: 6216339Abstract: A tool-actuated ejector for extracting electronic modular components. The ejector, which functions as a levered cam, has a body with a first end, a second end and a pivot located intermediate the first and second ends. A tool-receiving socket mounts at the second end. A tool, such as a screwdriver with a blade that matches the shape of the socket, actuates the ejector by applying a force to the socket. A cam, located at the first end, engages the electronic modular component. To provide a mechanical advantage, the distance between the tool-receiving socket and the pivot, which constitutes one lever arm, is greater than the distance between the cam and the pivot, which constitutes a second lever arm. In addition, a shock absorber mounts on the body and gliders extend below the body to provide stability and balance to the ejector. The ejector mounts in a casing having a tool passage that communicates with the tool-receiving socket and the exterior of the casing.Type: GrantFiled: May 8, 1998Date of Patent: April 17, 2001Assignee: 3Com CorporationInventor: Daniel Rich
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Patent number: 6204444Abstract: An electromagnetic interference shielding gasket extends through a slot in a face plate assembly bracket arm from the underside thereof. The gasket is secured to the underside of the bracket arm to avoid the problem of the gasket peeling from the bracket arm when circuit card assemblies are inserted into and removed from slots in a shelf unit.Type: GrantFiled: June 28, 1999Date of Patent: March 20, 2001Assignee: Lucent Technologies Inc.Inventors: Mark R. Pugliese, Daniel Rich, David H. Schilling