Patents by Inventor Daniel Rich

Daniel Rich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250379004
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Application
    Filed: August 14, 2025
    Publication date: December 11, 2025
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 12406815
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: September 2, 2025
    Assignee: NANORAMIC, INC.
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 12130095
    Abstract: Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: October 29, 2024
    Assignee: Henkel AG & Co. KGaA
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Patent number: 11450488
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: September 20, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 11441855
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: September 13, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Patent number: 11410820
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: August 9, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 11326843
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: May 10, 2022
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210389062
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 16, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210265234
    Abstract: Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20210254910
    Abstract: A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 19, 2021
    Inventors: Yong Joon Lee, William J. Scimeca, Nicolo Brambilla, Daniel Rich
  • Publication number: 20200227211
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 16, 2020
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 10600582
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: March 24, 2020
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Publication number: 20200082997
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 12, 2020
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Publication number: 20190371534
    Abstract: An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.
    Type: Application
    Filed: May 31, 2019
    Publication date: December 5, 2019
    Applicant: FastCAP SYSTEMS Corporation
    Inventors: Nicolò Michele Brambilla, Fabrizio Martini, Daniel Rich
  • Patent number: 6216339
    Abstract: A tool-actuated ejector for extracting electronic modular components. The ejector, which functions as a levered cam, has a body with a first end, a second end and a pivot located intermediate the first and second ends. A tool-receiving socket mounts at the second end. A tool, such as a screwdriver with a blade that matches the shape of the socket, actuates the ejector by applying a force to the socket. A cam, located at the first end, engages the electronic modular component. To provide a mechanical advantage, the distance between the tool-receiving socket and the pivot, which constitutes one lever arm, is greater than the distance between the cam and the pivot, which constitutes a second lever arm. In addition, a shock absorber mounts on the body and gliders extend below the body to provide stability and balance to the ejector. The ejector mounts in a casing having a tool passage that communicates with the tool-receiving socket and the exterior of the casing.
    Type: Grant
    Filed: May 8, 1998
    Date of Patent: April 17, 2001
    Assignee: 3Com Corporation
    Inventor: Daniel Rich
  • Patent number: 6204444
    Abstract: An electromagnetic interference shielding gasket extends through a slot in a face plate assembly bracket arm from the underside thereof. The gasket is secured to the underside of the bracket arm to avoid the problem of the gasket peeling from the bracket arm when circuit card assemblies are inserted into and removed from slots in a shelf unit.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: March 20, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Mark R. Pugliese, Daniel Rich, David H. Schilling