Abstract: The present disclosure includes methods of using a sacrificial, protective head overcoat during the manufacture of sliders. In some embodiments, the final trailing edge topography of the transducer devices is formed before applying the sacrificial, protective head overcoat. In some embodiments, the final trailing edge topography of the transducer devices is formed after removing the sacrificial, protective head overcoat.

Abstract: The present disclosure includes methods of using a sacrificial, protective head overcoat during the manufacture of sliders. In some embodiments, the final trailing edge topography of the transducer devices is formed before applying the sacrificial, protective head overcoat. In some embodiments, the final trailing edge topography of the transducer devices is formed after removing the sacrificial, protective head overcoat.

Abstract: The present disclosure includes methods of using a sacrificial, protective head overcoat during the manufacture of sliders. In some embodiments, the final trailing edge topography of the transducer devices is formed before applying the sacrificial, protective head overcoat. In some embodiments, the final trailing edge topography of the transducer devices is formed after removing the sacrificial, protective head overcoat.

Abstract: The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).

Abstract: The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).

Abstract: The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).

Abstract: Methods that include depositing a first layer over the entire surface of a structure, the structure having a magnetic reader and a magnetic writer, wherein the magnetic reader and the magnetic writer are positioned adjacent to each other on a substrate and the magnetic writer includes a near field transducer (NFT); depositing a second layer over the entire surface of the first layer; depositing a photoresist material layer over the entire surface of the second layer, the photoresist material layer having a bottom surface in contact with the second layer and an opposing top surface; exposing the photoresist material layer to radiation through the bottom surface of the photoresist material layer via the NFT to form a first exposed region; and exposing the photoresist material layer to radiation through the top surface of the photoresist material layer to form a second exposed region.

Abstract: Methods that include depositing a first layer over the entire surface of a structure, the structure having a magnetic reader and a magnetic writer, wherein the magnetic reader and the magnetic writer are positioned adjacent to each other on a substrate and the magnetic writer includes a near field transducer (NFT); depositing a second layer over the entire surface of the first layer; depositing a photoresist material layer over the entire surface of the second layer, the photoresist material layer having a bottom surface in contact with the second layer and an opposing top surface; exposing the photoresist material layer to radiation through the bottom surface of the photoresist material layer via the NFT to form a first exposed region; and exposing the photoresist material layer to radiation through the top surface of the photoresist material layer to form a second exposed region.

Abstract: An air-bearing surface of a slider is coated with a photoresist having a high optical absorbance at or near an operational wavelength of the slider. Light is directed at a target wavelength through an entry of a waveguide integrated into the slider. The light exiting the waveguide forms a feature through the photoresist, the feature proximate a near-field transducer of the slider. A sub-micron pattern is formed using the feature.

Abstract: A slider for a data recording device such as a disc drive. The slider has a pattern, which can be a micro-pattern, of SAM material on the air-bearing surface (ABS). The pattern comprises discrete unconnected features, such as dots or lines, that may or may no cover the entire ABS. Methods of micro-printing on the ABS are also provided.

Abstract: Methods for providing a SAM (self-assembled monolayer) coating on a slider and subsequently removing a portion of the SAM coating. In one implementation, the method includes applying a SAM coating on at least a first surface of a slider and on a second surface of the slider opposite the first surface, and removing at least a portion of the SAM coating from the second surface by irradiating the second surface with UV radiation in a wavelength range of 100-200 nm.

Abstract: An air-bearing surface of a slider is coated with a photoresist having a high optical absorbance at or near an operational wavelength of the slider. Light is directed at a target wavelength through an entry of a waveguide integrated into the slider. The light exiting the waveguide forms a feature through the photoresist, the feature proximate a near-field transducer of the slider. A sub-micron pattern is formed using the feature.

Abstract: A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.