Patents by Inventor Daniel Robert Queen
Daniel Robert Queen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11937518Abstract: One example includes a superconducting circuit. The circuit superconducting circuitry fabricated on a first surface of a circuit layer. The circuit layer includes a dielectric material. The circuit also includes a metal layer formed on a second surface of the circuit layer opposite the first surface and a through-substrate via (TSV) conductively coupled to the metal layer and extending through the circuit layer to the first surface. The circuit further includes a flux gasket conductively coupled to and extending from the TSV on the first surface proximal to the superconducting circuitry. The flux gasket can be configured to divert magnetic fields away from the superconducting circuitry.Type: GrantFiled: May 20, 2022Date of Patent: March 19, 2024Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventor: Daniel Robert Queen
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Publication number: 20230380301Abstract: One example includes a superconducting circuit. The circuit superconducting circuitry fabricated on a first surface of a circuit layer. The circuit layer includes a dielectric material. The circuit also includes a metal layer formed on a second surface of the circuit layer opposite the first surface and a through-substrate via (TSV) conductively coupled to the metal layer and extending through the circuit layer to the first surface. The circuit further includes a flux gasket conductively coupled to and extending from the TSV on the first surface proximal to the superconducting circuitry. The flux gasket can be configured to divert magnetic fields away from the superconducting circuitry.Type: ApplicationFiled: May 20, 2022Publication date: November 23, 2023Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventor: DANIEL ROBERT QUEEN
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Publication number: 20230260679Abstract: One example includes a superconducting circuit. The circuit includes superconducting circuitry fabricated in a circuit layer. The circuit layer includes a first surface and a second surface opposite the first surface. The circuit also includes a flux moat comprising a dielectric material formed in the circuit layer. The flux moat can be configured to trap a magnetic flux as the superconducting circuit is cooled to below a superconducting critical temperature. The circuit further includes a magnetic film arranged proximal to the flux moat on at least one of the first and second surfaces of the circuit layer. The magnetic film can be configured to guide the magnetic flux to the flux moat as the superconducting circuit is cooled to below the superconducting critical temperature.Type: ApplicationFiled: February 14, 2022Publication date: August 17, 2023Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventor: Daniel Robert Queen
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Patent number: 10727162Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.Type: GrantFiled: January 7, 2019Date of Patent: July 28, 2020Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Patrick Loney, Robert Miles Young, Daniel Robert Queen, Aaron Ashley Hathaway, John X. Przybysz
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Patent number: 10629535Abstract: An integrated circuit is provided that comprises a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement. The second ground plane is substantially thermally isolated from the first ground plane. A superconducting coupler electrically couples the first ground plane and the second ground plane while maintaining relative thermal isolation between the first ground plane and the second ground plane.Type: GrantFiled: October 31, 2017Date of Patent: April 21, 2020Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Patrick Alan Loney, Aaron Ashley Hathaway, Daniel Robert Queen, John X. Przybysz, Robert Miles Young
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Publication number: 20190157184Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.Type: ApplicationFiled: January 7, 2019Publication date: May 23, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: PATRICK LONEY, ROBERT MILES YOUNG, DANIEL ROBERT QUEEN, AARON ASHLEY HATHAWAY, JOHN X. PRZYBYSZ
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Publication number: 20190131246Abstract: An integrated circuit is provided that comprises a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement. The second ground plane is substantially thermally isolated from the first ground plane. A superconducting coupler electrically couples the first ground plane and the second ground plane while maintaining relative thermal isolation between the first ground plane and the second ground plane.Type: ApplicationFiled: October 31, 2017Publication date: May 2, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: PATRICK ALAN LONEY, AARON ASHLEY HATHAWAY, DANIEL ROBERT QUEEN, JOHN X. PRZYBYSZ, ROBERT MILES YOUNG
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Publication number: 20190080983Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.Type: ApplicationFiled: September 14, 2017Publication date: March 14, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: PATRICK LONEY, ROBERT MILES YOUNG, DANIEL ROBERT QUEEN, AARON ASHLEY HATHAWAY, JOHN X. PRZYBYSZ
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Patent number: 10229864Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.Type: GrantFiled: September 14, 2017Date of Patent: March 12, 2019Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Patrick Loney, Robert Miles Young, Daniel Robert Queen, Aaron Ashley Hathaway, John X. Przybysz