Patents by Inventor Daniel S. Coops

Daniel S. Coops has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for including parametric in-line test data in simulations for improved model to hardware correlation
    Patent number: 6934671
    Abstract: A method of performing model to hardware correlation that simulates models based upon design criteria and manufactures devices based upon the design criteria. The method evaluates features of the devices during the manufacturing to produce in-line test parametric data, compares the models to the in-line test parametric data to obtain correlation data, and modifies the simulating according to the correlation data.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: August 23, 2005
    Assignee: International Business Machines Corporation
    Inventors: John E. Bertsch, Daniel S. Coops, David M. Fried
  • Method and system for including parametric in-line test data in simulations for improved model to hardware correlation
    Publication number: 20020193892
    Abstract: A method of performing model to hardware correlation that simulates models based upon design criteria and manufactures devices based upon the design criteria. The method evaluates features of the devices during the manufacturing to produce in-line test parametric data, compares the models to the in-line test parametric data to obtain correlation data, and modifies the simulating according to the correlation data.
    Type: Application
    Filed: May 29, 2001
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: John E. Bertsch, Daniel S. Coops, David M. Fried