Patents by Inventor Daniel S Eichorn

Daniel S Eichorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board inter-connection system and method
    Patent number: 7204730
    Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: April 17, 2007
    Assignee: Delphi Technologies, Inc.
    Inventors: Daniel S Eichorn, Michael W Allender, Dominic Anthony Messuri, Christopher Alan Brandon
  • Circuit board inter-connection system and method
    Patent number: 7025640
    Abstract: An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: April 11, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Daniel S Eichorn, Michael W Allender, Dominic Anthony Messuri, Christopher Alan Brandon