Patents by Inventor Daniel S. GIANOLA

Daniel S. GIANOLA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper alloys for interconnectors and methods for making the same
    Patent number: 11776893
    Abstract: Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: October 3, 2023
    Assignee: The Trustees of the University of Pennsylvania
    Inventors: Daniel S. Gianola, Gyuseok Kim
  • COPPER ALLOYS FOR INTERCONNECTORS AND METHODS FOR MAKING THE SAME
    Publication number: 20200194365
    Abstract: Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.
    Type: Application
    Filed: June 19, 2018
    Publication date: June 18, 2020
    Inventors: Daniel S. GIANOLA, Gyuseok KIM