Patents by Inventor Daniel S. Herkalo

Daniel S. Herkalo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lift pin assembly for substrate processing
    Patent number: 7204888
    Abstract: Embodiments of the present invention provide an apparatus for constraining and supporting the lift pins to prevent or minimize lateral movement of the lift pins that causes substrate hand-off problems and associated degradation in substrate processing characteristics and results. In one embodiment, a lift pin assembly for manipulating a substrate above a support surface of a substrate support comprises a plurality of lift pins movable between an up position and a down position. The lift pins include top ends and bottom ends. The top ends are configured to be lifted above the support surface of the substrate support to contact a bottom surface of the substrate in the up position. The top ends are configured to be positioned at or below the support surface of the substrate support in the down position.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: April 17, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Toan Q. Tran, Daniel S. Herkalo, Yen-Kun V. Wang, Jin Ho Lee, Dong Hyung Lee, Jang Seok Oh, Won B. Bang
  • Lift pin assembly for substrate processing
    Publication number: 20040219006
    Abstract: Embodiments of the present invention provide an apparatus for constraining and supporting the lift pins to prevent or minimize lateral movement of the lift pins that causes substrate hand-off problems and associated degradation in substrate processing characteristics and results. In one embodiment, a lift pin assembly for manipulating a substrate above a support surface of a substrate support comprises a plurality of lift pins movable between an up position and a down position. The lift pins include top ends and bottom ends. The top ends are configured to be lifted above the support surface of the substrate support to contact a bottom surface of the substrate in the up position. The top ends are configured to be positioned at or below the support surface of the substrate support in the down position.
    Type: Application
    Filed: May 1, 2003
    Publication date: November 4, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Toan Q. Tran, Daniel S. Herkalo, Yen-Kun V. Wang, Jin Ho Lee, Dong Hyung Lee, Jang Seok Oh, Won B. Bang