Patents by Inventor Daniel S. Kahn

Daniel S. Kahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10345463
    Abstract: Embodiments of using known source locations in seismic data processing are disclosed. In one embodiment, a method of locating a seismic event includes receiving location information for a plurality of known source events proximate the seismic event, and determining an estimated location of the seismic event using a relative locator constrained by the location information for the plurality of known source events.
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: July 9, 2019
    Assignee: ION Geophysical Corporation
    Inventors: Daniel S. Kahn, Jacques P. Leveille
  • Patent number: 10061046
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: August 28, 2018
    Assignee: ION Geophysical Corporation
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Patent number: 9448313
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: September 20, 2016
    Assignee: ION Geophysical Corporation
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Publication number: 20150241582
    Abstract: Embodiments of using known source locations in seismic data processing are disclosed. In one embodiment, a method of locating a seismic event includes receiving location information for a plurality of known source events proximate the seismic event, and determining an estimated location of the seismic event using a relative locator constrained by the location information for the plurality of known source events.
    Type: Application
    Filed: January 12, 2015
    Publication date: August 27, 2015
    Inventors: DANIEL S. KAHN, JACQUES P. LEVEILLE
  • Publication number: 20140278120
    Abstract: Embodiments of locating seismic events are disclosed. In one embodiment, a single difference seismic locator and a reverse double difference seismic locator are combined into a combined system of equations, and the combined system of equations is solved to determine a location of the seismic event in substantially real time relative to the seismic event. The combined system of equations may be weighted such that the determined location of the seismic event is partially influenced by the single difference seismic locator and partially influenced by the reverse double difference seismic locator.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: ION Geophysical Corporation
    Inventors: Daniel S. Kahn, Michael E. Glinsky
  • Publication number: 20130215716
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 22, 2013
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Publication number: 20130215717
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 22, 2013
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur