Patents by Inventor Daniel S. Lam

Daniel S. Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for providing high RF signal isolation and low common ground inductance in an RF circuit testing environment
    Patent number: 7053640
    Abstract: High port-to-port RF isolation for a test socket in a production RF test environment is achieved by establishing a coaxial-type connection between the test socket and the device under test (DUT). This coaxial-type connection results by at least partially surrounding each port of the DUT with a ground seal connected to RF ground connection. In one embodiment, the ground seal is a metallic base plate of the test socket which surrounds the RF connection to the DUT.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: May 30, 2006
    Assignee: Agilent Technologies, Inc.
    Inventors: David A. Feld, Daniel S. Lam, Paul D. Bradley
  • System and method for providing high RF signal isolation and low common ground inductance in an RF circuit testing environment
    Publication number: 20040124864
    Abstract: High port-to-port RF isolation for a test socket in a production RF test environment is achieved by establishing a coaxial-type connection between the test socket and the device under test (DUT). This coaxial-type connection results by at least partially surrounding each port of the DUT with a ground seal connected to RF ground connection. In one embodiment, the ground seal is a metallic base plate of the test socket which surrounds the RF connection to the DUT.
    Type: Application
    Filed: December 27, 2002
    Publication date: July 1, 2004
    Inventors: David A. Feld, Daniel S. Lam, Paul D. Bradley