Abstract: Data processing devices in a data center are more easily relocated by consolidating the data and power connections to the data processing devices within a mobile data cabinet. The mobile data cabinet includes an access switch to consolidate communications and connections among computing devices in the mobile cabinet and to consolidate communications to a central communication service through a main communication cable. A single data communication connection through the main communication cable and a single electrical power connection through a power delivery cable to the mobile cabinet reduces and simplifies number and difficulty of the disconnections and connections that must be made to move the mobile cabinet.

Abstract: Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach circuitized chips. The land area is temporarily extended by depositing a relatively thin layer of metal beyond the perimeter of the land, wave soldering to deposit excess solder on the extended land region, and reflow, whereby the thin layer of metal dissolves into the solder, causing the solder to retract to the dimensions of the original land. Because the volume of solder is increased, the strength and reliability of the solder joint is greatly improved.

Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.