Patents by Inventor Daniel S. Schwartz

Daniel S. Schwartz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969598
    Abstract: Systems and methods for controlling blood pressure via electrical stimulation of the heart are disclosed. Embodiments may include at least two different stimulation patterns, each configured to reduce blood pressure to a different degree, and may alternate between stimulation patterns based on the need of a patient, for example, alternating between day and night or between periods of strenuous and light activity. Some embodiments may take advantage of a slow baroreflex response that occurs after treatment is stopped, suspending treatment for extended periods, and then resuming treatment before blood pressure levels reach pretreatment values. Embodiments may control blood pressure by controlling atrial pressure and atrial stretch.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: April 30, 2024
    Assignee: BackBeat Medical, LLC
    Inventors: Yuval Mika, Darren Sherman, Robert S. Schwartz, Robert A. Van Tassel, Daniel Burkhoff
  • Patent number: 6168072
    Abstract: The present invention provides a method of diffusion bonding a first article containing a thermally activated expansion agent to a second article. The first article and the second article are placed adjacent to each other at a bonding area. The first article and the second article are constrained such that contact is maintained between the first article and the second article at the bonding area. The constrained articles are then heated at a temperature that causes the first article to expand, creating pressure between the articles at the bonding area.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: January 2, 2001
    Assignee: The Boeing Company
    Inventors: Daniel S. Schwartz, Donald A. Deuser
  • Patent number: 6085965
    Abstract: A novel method of forming low density core metal parts by pressure bonding face sheets to a porous foam metal core and simultaneously densifying the core is disclosed. In particular, low density core aluminum and aluminum alloy parts can be formed according to the method of the invention. The method of forming low density core metal parts generally comprises the steps of providing a porous, foam metal core and simultaneously pressure bonding first and second solid metal face sheets directly to opposite sides of the core and densifying the core by applying heat and uniaxial forge pressure to the first and second face sheets and to the core for a predetermined period of time. The method of the invention can therefore produce LDC parts having a predetermined shape and density. Furthermore, the LDC parts are less subject to interfacial oxidation and delamination than conventional LDC parts made by brazing.
    Type: Grant
    Filed: February 4, 1997
    Date of Patent: July 11, 2000
    Assignee: McDonnel & Douglas Corporation
    Inventors: Daniel S. Schwartz, Donald A. Deuser, Rick L. Martin
  • Patent number: 5972521
    Abstract: The present invention provides a method of forming a continuous one-piece structural porous metal (SPM) structure having a predetermined geometry. The method the invention includes the steps of preparing a metal billet comprising a metal core formed of a metal and a gas, and solid metal face sheets bonded to opposite sides of the metal core; placing the metal billet in a mold cavity having a predetermined geometry defined by opposing inner surfaces of the mold with at least one of the opposing inner surfaces contacting at least a portion of the metal billet and spaced apart from at least a portion of the metal billet; and heating the metal billet to expand the metal core to form the expanded metal structure.
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: October 26, 1999
    Assignee: McDonnell Douglas Corporation
    Inventors: Christopher S. Huskamp, Donald A. Deuser, Daniel S. Schwartz
  • Patent number: 5855313
    Abstract: A two-step process for joining a first part to a second part, the first part having a coefficient of thermal expansion lower than the coefficient of thermal expansion of the second part. An anchor layer is then brazed at a lower temperature to the first part having a high thermal expansion coefficient. The anchor layer has a thickness such that upon cooling it will yield to relieve stress build up resulting from the differing thermal expansion coefficients between it and the first part. The anchor layer is then brazed to the part having a high thermal expansion coefficient. The process is particularly useful for joining carbon-carbon composite parts to copper substrates for use in the manufacture of high temperature heat exchangers as used, for example, in nuclear fusion reactors.
    Type: Grant
    Filed: April 8, 1997
    Date of Patent: January 5, 1999
    Assignee: McDonnell Douglas Corporation
    Inventors: James L. McAfee, Donald A. Deuser, John T. Niemann, Daniel S. Schwartz