Patents by Inventor Daniel S. Stevens
Daniel S. Stevens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10833531Abstract: A sensor module for monitoring an asset in an electrical power generation or distribution system includes a module body, a sensor, a sensor near field coupling structure, and an interrogation near field coupling structure. The sensor is supported by the module body, arranged to sense a parameter of the asset and configured to generate a sensor output relating to the parameter. The sensor near field coupling structure is connected to the sensor and supported on a first side of a module body. The interrogation near field coupling structure is supported on a second side of the module body. The sensor output is transmitted from the sensor near field coupling structure to the interrogation near field coupling structure. The sensor module is configured to provide electrical isolation between the asset and a monitoring circuit configured to receive the sensor output through the interrogation near field coupling structure.Type: GrantFiled: September 23, 2019Date of Patent: November 10, 2020Assignee: ROSEMOUNT INC.Inventors: Jeffrey C. Andle, David J. Lane, Thomas M. Cunneen, Daniel S. Stevens
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Publication number: 20200106296Abstract: A sensor module for monitoring an asset in an electrical power generation or distribution system includes a module body, a sensor, a sensor near field coupling structure, and an interrogation near field coupling structure. The sensor is supported by the module body, arranged to sense a parameter of the asset and configured to generate a sensor output relating to the parameter. The sensor near field coupling structure is connected to the sensor and supported on a first side of a module body. The interrogation near field coupling structure is supported on a second side of the module body. The sensor output is transmitted from the sensor near field coupling structure to the interrogation near field coupling structure. The sensor module is configured to provide electrical isolation between the asset and a monitoring circuit configured to receive the sensor output through the interrogation near field coupling structure.Type: ApplicationFiled: September 23, 2019Publication date: April 2, 2020Inventors: Jeffrey C. Andle, David J. Lane, Thomas M. Cunneen, Daniel S. Stevens
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Patent number: 8073640Abstract: The current invention relates to a conductivity-dielectric (CD) electrode design with apertures that allow compressional waves to propagate away from the surface of the acoustic wave device unimpeded. This prevents reflection of compressional waves that would interact with the viscosity sensor surface, thus altering the device response. It allows compressional waves to pass through, and allows the dual mode viscosity sensor responses to be utilized for density/viscosity/elasticity measurement and correlation. The invention further offers methods of instrumentation to detect unwanted reflections, to compensate, and to correct for the distortions caused by reflections. Finally, the invention provides a system and method for utilizing deliberately introduced reflections to obtain additional information, including fluid density.Type: GrantFiled: September 17, 2010Date of Patent: December 6, 2011Assignee: Delaware Capital Formation Inc.Inventors: Jeffrey C. Andle, Daniel S. Stevens, Reichl B. Haskell, Dana Y. G. Tucker
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Publication number: 20110071776Abstract: The current invention relates to a conductivity-dielectric (CD) electrode design with apertures that allow compressional waves to propagate away from the surface of the acoustic wave device unimpeded. This prevents reflection of compressional waves that would interact with the viscosity sensor surface, thus altering the device response. It allows compressional waves to pass through, and allows the dual mode viscosity sensor responses to be utilized for density/viscosity/elasticity measurement and correlation. The invention further offers methods of instrumentation to detect unwanted reflections, to compensate, and to correct for the distortions caused by reflections. Finally, the invention provides a system and method for utilizing deliberately introduced reflections to obtain additional information, including fluid density.Type: ApplicationFiled: September 17, 2010Publication date: March 24, 2011Applicant: DELAWARE CAPITAL FORMATION INC.Inventors: Jeffrey C. Andle, Daniel S. Stevens, Reichl B. Haskell, Dana Y.G. Tucker
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Publication number: 20110036151Abstract: Characterizing material properties using a simple and inexpensive measurement circuit is disclosed. It allows measurement of the transfer function change of an acoustic wave device without necessitating detailed knowledge of the resonant frequency, by integrating the transfer function. If one examines the integral of the transfer efficiency of an acoustic wave device as the acoustic wave is damped, one sees that the magnitude of the total signal transfer decreases with increasing damping allowing derivation of the material parameters from the results of simple integration.Type: ApplicationFiled: August 12, 2009Publication date: February 17, 2011Applicant: DELAWARE CAPITAL FORMATION, INC.Inventors: Jeffrey C. Andle, Daniel S. Stevens, Reichl B. Haskell
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Publication number: 20100043560Abstract: Reflective and slanted array channelized sensor arrays having a broadband source providing acoustic energy to a reflective or slanted array that reflects a portion of the incident signal to one or more sensing films wherein the response is measured.Type: ApplicationFiled: November 2, 2009Publication date: February 25, 2010Applicant: DELAWARE CAPITAL FORMATION, INC.Inventors: Jeffrey C. Andle, Daniel S. Stevens, Dong-Pei Chen
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Publication number: 20090206844Abstract: An acoustic wave sensor employs an electromagnetic device (EMD) to transduce and amplify the response of an impedance element to a physical measurand. One embodiment uses a magnetic field sensor employing a microelectromechanical system (MEMS) capacitor to affect a change in the response of a SAW filter.Type: ApplicationFiled: February 14, 2008Publication date: August 20, 2009Applicant: DELAWARE CAPITAL FORMATION, INC.Inventors: Sabah Sabah, Jeffrey C. Andle, Daniel S. Stevens
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Publication number: 20080163694Abstract: Acoustic sensing utilizing a bridge structure coupled about a portion of at least two sides of said bridge to a base substrate, wherein said bridge includes a piezoelectric section and has at least one active acoustic region proximate said bridge. A sensing material is disposed on at least a portion of at least one surface of the bridge, wherein the bridge produces stress effects measurable by an acoustic wave device located in the active acoustic region. According to one embodiment, the stress effects are measured by an acoustic wave device to sense a target matter. As target molecules accumulate on a sensing film affixed to at least a portion of the bridge, stress is produced in the bridge inducing a frequency change measured by an acoustic wave device.Type: ApplicationFiled: October 19, 2007Publication date: July 10, 2008Applicant: DELAWARE CAPITAL FORMATION INCORPORATEDInventors: Reichl B. Haskell, Daniel S. Stevens, Jeffrey C. Andle
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Publication number: 20080100176Abstract: Acoustic sensing utilizing a cantilever structure coupled about at least one side of said cantilever to a base substrate, wherein said cantilever includes a piezoelectric section and has at least one acoustic wave device on a portion of the cantilever, wherein a flexure of the cantilever produces force-frequency effects measurable by the acoustic wave device. According to one embodiment, the cantilever sensor uses the flexure-frequency effect as measured by an acoustic wave device to sense a target matter. According to one embodiment, a sensing material is disposed on at least a portion of at least one surface of the cantilever.Type: ApplicationFiled: May 24, 2007Publication date: May 1, 2008Applicant: DELAWARE CAPITAL FORMATION INCORPORATEDInventors: Reichl B. Haskell, Daniel S. Stevens, Jeffrey C. Andle
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Patent number: 6984925Abstract: The invention is a method and apparatus for improving the aging, pressure sensitivity, and acceleration sensitivity of crystal resonators. In one embodiment the invention includes a coplanar two-dimensional compliant mounting structure, wherein the symmetry and compliance of the planar mounting structure reduces the effects of residual static stresses and dynamic vibratory stresses on the vibration sensitivity performance of a crystal resonator. The structural elements include compliance loops that provide relief from the effects associated with manufacturing, thermal and vibration stresses.Type: GrantFiled: May 28, 2003Date of Patent: January 10, 2006Assignee: Delaware Capital Formation, INCInventors: Peter E. Morley, Reichl B. Haskell, Daniel S. Stevens
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Publication number: 20040021402Abstract: The invention is a method and apparatus for improving the aging, pressure sensitivity, and acceleration sensitivity of crystal resonators. In one embodiment the invention includes a coplanar two-dimensional compliant mounting structure, wherein the symmetry and compliance of the planar mounting structure reduces the effects of residual static stresses and dynamic vibratory stresses on the vibration sensitivity performance of a crystal resonator. The structural elements include compliance loops that provide relief from the effects associated with manufacturing, thermal and vibration stresses.Type: ApplicationFiled: May 28, 2003Publication date: February 5, 2004Inventors: Peter E. Morley, Reichl B. Haskell, Daniel S. Stevens
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Publication number: 20040000844Abstract: A temperature compensated mounting structure, such that the stress applied to the resonator element by the mounting is minimized over a wide range of temperatures. This compensation significantly reduces or eliminates residual stresses from earlier process stages, such as cement curing, as well as stresses induced by ambient temperature changes. The entire structure is designed to be stress-free by the selection of materials and the dimensions of the elements. The geometry of the structure and the choice of materials are selected based on their linear and higher order expansion coefficients so as to minimize the forces between the resonator element and the mount resulting from temperature changes.Type: ApplicationFiled: June 30, 2003Publication date: January 1, 2004Inventors: Peter E. Morley, Daniel S. Stevens