Abstract: A sensor module for monitoring an asset in an electrical power generation or distribution system includes a module body, a sensor, a sensor near field coupling structure, and an interrogation near field coupling structure. The sensor is supported by the module body, arranged to sense a parameter of the asset and configured to generate a sensor output relating to the parameter. The sensor near field coupling structure is connected to the sensor and supported on a first side of a module body. The interrogation near field coupling structure is supported on a second side of the module body. The sensor output is transmitted from the sensor near field coupling structure to the interrogation near field coupling structure. The sensor module is configured to provide electrical isolation between the asset and a monitoring circuit configured to receive the sensor output through the interrogation near field coupling structure.

Abstract: A sensor module for monitoring an asset in an electrical power generation or distribution system includes a module body, a sensor, a sensor near field coupling structure, and an interrogation near field coupling structure. The sensor is supported by the module body, arranged to sense a parameter of the asset and configured to generate a sensor output relating to the parameter. The sensor near field coupling structure is connected to the sensor and supported on a first side of a module body. The interrogation near field coupling structure is supported on a second side of the module body. The sensor output is transmitted from the sensor near field coupling structure to the interrogation near field coupling structure. The sensor module is configured to provide electrical isolation between the asset and a monitoring circuit configured to receive the sensor output through the interrogation near field coupling structure.

Abstract: The current invention relates to a conductivity-dielectric (CD) electrode design with apertures that allow compressional waves to propagate away from the surface of the acoustic wave device unimpeded. This prevents reflection of compressional waves that would interact with the viscosity sensor surface, thus altering the device response. It allows compressional waves to pass through, and allows the dual mode viscosity sensor responses to be utilized for density/viscosity/elasticity measurement and correlation. The invention further offers methods of instrumentation to detect unwanted reflections, to compensate, and to correct for the distortions caused by reflections. Finally, the invention provides a system and method for utilizing deliberately introduced reflections to obtain additional information, including fluid density.

Abstract: An integrated package provides contactless communication through a coupling mechanism embedded in the package. Package types include Surface Mount Technology (SMT), Low Temperature Co-fired Ceramic (LTCC) technology, and dual-in-line integrated circuit pressed ceramic packages generally. The package can include an acoustic wave device (AWD) sensor such as a surface acoustic wave (SAW) device or a bulk acoustic wave (BAW) device. Coupling includes inductive and capacitive effects through plates, loops, spirals, and coils. Coil inductance and SAW capacitance can be parallel resonant at the desired SAW resonance with the coil impedance higher than the SAW impedance, minimizing load-pull effects.

Abstract: Reflective and slanted array channelized sensor arrays having a broadband source providing acoustic energy to a reflective or slanted array that reflects a portion of the incident signal to one or more sensing films wherein the response is measured.

Abstract: The current invention relates to a conductivity-dielectric (CD) electrode design with apertures that allow compressional waves to propagate away from the surface of the acoustic wave device unimpeded. This prevents reflection of compressional waves that would interact with the viscosity sensor surface, thus altering the device response. It allows compressional waves to pass through, and allows the dual mode viscosity sensor responses to be utilized for density/viscosity/elasticity measurement and correlation. The invention further offers methods of instrumentation to detect unwanted reflections, to compensate, and to correct for the distortions caused by reflections. Finally, the invention provides a system and method for utilizing deliberately introduced reflections to obtain additional information, including fluid density.

Abstract: Characterizing material properties using a simple and inexpensive measurement circuit is disclosed. It allows measurement of the transfer function change of an acoustic wave device without necessitating detailed knowledge of the resonant frequency, by integrating the transfer function. If one examines the integral of the transfer efficiency of an acoustic wave device as the acoustic wave is damped, one sees that the magnitude of the total signal transfer decreases with increasing damping allowing derivation of the material parameters from the results of simple integration.

Abstract: Acoustic sensing utilizing a bridge structure coupled about a portion of at least two sides of said bridge to a base substrate, wherein said bridge includes a piezoelectric section and has at least one active acoustic region proximate said bridge. A sensing material is disposed on at least a portion of at least one surface of the bridge, wherein the bridge produces stress effects measurable by an acoustic wave device located in the active acoustic region. According to one embodiment, the stress effects are measured by an acoustic wave device to sense a target matter. As target molecules accumulate on a sensing film affixed to at least a portion of the bridge, stress is produced in the bridge inducing a frequency change measured by an acoustic wave device.

Abstract: An acoustic wave sensor employs an electromagnetic device (EMD) to transduce and amplify the response of an impedance element to a physical measurand. A measurand is defined as a physical parameter being quantified by measurement. One embodiment uses a magnetic field sensor employing a microelectromechanical system (MEMS) capacitor to affect a change in the response of a SAW filter.

Abstract: An integrated package provides contactless communication through a coupling mechanism embedded in the package. Package types include Surface Mount Technology (SMT), Low Temperature Co-fired Ceramic (LTCC) technology, and dual-in-line integrated circuit pressed ceramic packages generally. The package can include an acoustic wave device (AWD) sensor such as a surface acoustic wave (SAW) device or a bulk acoustic wave (BAW) device. Coupling includes inductive and capacitive effects through plates, loops, spirals, and coils. Coil inductance and SAW capacitance can be parallel resonant at the desired SAW resonance with the coil impedance higher than the SAW impedance, minimizing load-pull effects.

Abstract: Reflective and slanted array channelized sensor arrays having a broadband source providing acoustic energy to a reflective or slanted array that reflects a portion of the incident signal to one or more sensing films wherein the response is measured.

Abstract: Acoustic sensing utilizing a cantilever structure coupled about at least one side of said cantilever to a base substrate, wherein said cantilever includes a piezoelectric section and has at least one acoustic wave device on a portion of the cantilever, wherein a flexure of the cantilever produces force-frequency effects measurable by the acoustic wave device. According to one embodiment, the cantilever sensor uses the flexure-frequency effect as measured by an acoustic wave device to sense a target matter. According to one embodiment, a sensing material is disposed on at least a portion of at least one surface of the cantilever.

Abstract: Reflective and slanted array channelized sensor arrays having a broadband source providing acoustic energy to a reflective or slanted array that reflects a portion of the incident signal to one or more sensing films wherein the response is measured.

Abstract: An acoustic wave sensor employs an electromagnetic device (EMD) to transduce and amplify the response of an impedance element to a physical measurand. One embodiment uses a magnetic field sensor employing a microelectromechanical system (MEMS) capacitor to affect a change in the response of a SAW filter.

Abstract: Reflective and slanted array channelized sensor arrays having a broadband source providing acoustic energy to a reflective or slanted array that reflects a portion of the incident signal to one or more sensing films wherein the response is measured.

Abstract: Acoustic sensing utilizing a bridge structure coupled about a portion of at least two sides of said bridge to a base substrate, wherein said bridge includes a piezoelectric section and has at least one active acoustic region proximate said bridge. A sensing material is disposed on at least a portion of at least one surface of the bridge, wherein the bridge produces stress effects measurable by an acoustic wave device located in the active acoustic region. According to one embodiment, the stress effects are measured by an acoustic wave device to sense a target matter. As target molecules accumulate on a sensing film affixed to at least a portion of the bridge, stress is produced in the bridge inducing a frequency change measured by an acoustic wave device.

Abstract: Acoustic sensing utilizing a cantilever structure coupled about at least one side of said cantilever to a base substrate, wherein said cantilever includes a piezoelectric section and has at least one acoustic wave device on a portion of the cantilever, wherein a flexure of the cantilever produces force-frequency effects measurable by the acoustic wave device. According to one embodiment, the cantilever sensor uses the flexure-frequency effect as measured by an acoustic wave device to sense a target matter. According to one embodiment, a sensing material is disposed on at least a portion of at least one surface of the cantilever.

Abstract: A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. In one embodiment the present invention is a multi-cavity package having at least one substrate forming at least one cavity with the substrate coupled to a shelf within the sidewalls of the package.

Abstract: The invention is a method and apparatus for improving the aging, pressure sensitivity, and acceleration sensitivity of crystal resonators. In one embodiment the invention includes a coplanar two-dimensional compliant mounting structure, wherein the symmetry and compliance of the planar mounting structure reduces the effects of residual static stresses and dynamic vibratory stresses on the vibration sensitivity performance of a crystal resonator. The structural elements include compliance loops that provide relief from the effects associated with manufacturing, thermal and vibration stresses.

Abstract: The invention is a method and apparatus for improving the aging, pressure sensitivity, and acceleration sensitivity of crystal resonators. In one embodiment the invention includes a coplanar two-dimensional compliant mounting structure, wherein the symmetry and compliance of the planar mounting structure reduces the effects of residual static stresses and dynamic vibratory stresses on the vibration sensitivity performance of a crystal resonator. The structural elements include compliance loops that provide relief from the effects associated with manufacturing, thermal and vibration stresses.