Patents by Inventor Daniel S. Troiano

Daniel S. Troiano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip mold seal
    Patent number: 6302672
    Abstract: A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: October 16, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Raymond A. Frechette, Daniel S. Troiano
  • Integrated circuit chip mold seal
    Patent number: 6302673
    Abstract: A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: October 16, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Raymond A. Frechette, Daniel S. Troiano
  • Integrated circuit chip mold seal
    Patent number: 5942178
    Abstract: A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: August 24, 1999
    Assignee: Texas Instruments Incorporated
    Inventors: Raymond A. Frechette, Daniel S. Troiano