Abstract: A product, in particular a component carrier, including: i) an electrically insulating layer structure; ii) an electrically conductive layer structure; and iii) at least one glass barrier layer, at least partially sandwiched between the electrically insulating layer structure and the electrically conductive layer structure. The at least one glass barrier layer has two main surfaces. The two main surfaces have a different adhesion property. Further, a manufacturing method is described.

Abstract: A component carrier having a stack with i) at least one electrically conductive layer structure and at least one electrically insulating layer structure; and ii) a cavity provided in the stack. The cavity includes a) a first cavity portion provided on a first vertical level of the stack, wherein the first cavity portion partially vertically extends along the thickness of a first electrically insulating layer structure of the at least one electrically insulating layer structure, and b) a second cavity portion provided on a second vertical level of the stack, wherein the first cavity portion and the second cavity portion are connected to each other through their vertical thickness extension in the stack.

Abstract: A metal structure for a component carrier includes a first metal layer structure having a first recess exposed to a first surface and defining a first external boundary profile; and a second metal layer structure having a second recess exposed to a second surface and defining a second external boundary profile. The first metal layer structure and the second metal layer structure are stacked to face each other, so that the first recess and the second recess define a common recess, and the first external boundary profile of the first recess and the second external boundary profile of the second recess are misaligned in the stacking direction of the metal structure.

Abstract: An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.

Abstract: A component carrier includes a stack of layers forming at least one electrically conductive layer structure and at least one electrically insulating layer structure, the stack including a—preferably conically shaped—cavity, wherein the cavity extends—in the direction perpendicular to the planes in which the layers extend—through at least two layers of the stack of layers, the cavity being delimited by a side wall, the side wall being inclined with respect to the direction perpendicular to the planes of the layers, wherein at least one recess in the side wall of the cavity locally disrupts the side wall extension and partially extends in the stack along the planar extension of the stack.

Abstract: A component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and an at least partially optically transparent body on and/or in the stack, said at least partially optically transparent body being configured to guide light entering from or exiting to an external periphery of the at least partially optically transparent body along a predefined trajectory.

Abstract: A component carrier includes a layer stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, at least one opening in the layer stack, a first curable dielectric element arranged at least partially on the opening, and a second curable dielectric element arranged adjacent to the first curable dielectric element, so that there is an interface region in between. A part of the first curable dielectric element extends partially into the opening.