Patents by Inventor Daniel Schnabel

Daniel Schnabel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • First die indicator for integrated circuit wafer
    Publication number: 20060267617
    Abstract: An integrated circuit (IC) wafer includes a plurality of die and a first die indicator (FDI) formed on the wafer in a metal layer. The plurality of die include a first potentially good die and the FDI, which is detectable by a machine vision recognition system, provides a unique indication of the first potentially good die.
    Type: Application
    Filed: May 31, 2005
    Publication date: November 30, 2006
    Inventors: Jeffrey Quinton, Timothy Allison, Daniel Schnabel, Brad Silvers, Joseph Ney, Robert Grossman