Patents by Inventor Daniel Scott Johnson

Daniel Scott Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive-less cover on area array bonding site of circuit board
    Patent number: 6700068
    Abstract: An apparatus, program product and method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site for form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: March 2, 2004
    Assignee: International Business Machines Corporation
    Inventors: Mark Kenneth Hoffmeyer, Daniel Scott Johnson
  • Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
    Patent number: 6499215
    Abstract: A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site to form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: December 31, 2002
    Assignee: International Business Machines Corporation
    Inventors: Mark Kenneth Hoffmeyer, Daniel Scott Johnson
  • Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
    Publication number: 20020000329
    Abstract: An apparatus, program product and method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a plurality of apertures patterned about the bonding site for form a footprint. A protective cover shaped to conform to the footprint includes posts registered to removably fit into the apertures. The protective cover remains overlaid on the circuit board during fabrication processes such as solder screen printing, rework, and washing, and then removed. Thus, contamination from the fabrication processes is avoided, as well as eliminating possible sources of contamination from use of adhesive tape for protection.
    Type: Application
    Filed: August 8, 2001
    Publication date: January 3, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark Kenneth Hoffmeyer, Daniel Scott Johnson