Patents by Inventor Daniel So

Daniel So has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing of monolithically integrated pin structures
    Patent number: 7067394
    Abstract: Fabrication techniques for fabricating p-i-n structures that achieve a thin intrinsic layer and a small resistance across the p-i-n structure and thus a high response speed in a monolithically integrated circuit package. Germanium p-i-n structures may be fabricated over silicon or silicon-on-insulator substrates using silicon processing technologies.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: June 27, 2006
    Assignee: Intel Corporation
    Inventor: Daniel So
  • Manufacturing of monolithically integrated pin structures
    Publication number: 20050186759
    Abstract: Fabrication techniques for fabricating p-i-n structures that achieve a thin intrinsic layer and a small resistance across the p-i-n structure and thus a high response speed in a monolithically integrated circuit package. Germanium p-i-n structures may be fabricated over silicon or silicon-on-insulator substrates using silicon processing technologies.
    Type: Application
    Filed: February 25, 2004
    Publication date: August 25, 2005
    Inventor: Daniel So