Abstract: A housing for an electronic device comprising: a core layer comprising a first thermoplastic material; a first skin layer comprising a second thermoplastic material located on a first side of the core layer; a second skin layer comprising the second thermoplastic material located on a second side of the core layer opposite the first side; wherein the core layer comprises a foam structure, a honeycomb structure, or combinations thereof; and wherein the thickness of the core layer is 30% to 75% of the total thickness of the housing.

Abstract: In an embodiment, an A-B-A structure, can comprise: a core layer comprising a first thermoplastic material having a first density (Y), wherein the core layer has a core thickness and wherein the core layer comprise at least one of (i) a through plane thermal conductivity of greater than equal to 0.1 W/m K, and (ii) a core layer density (X) that is X?0.8Y; a first outer layer comprising a second thermoplastic material located on a first side of the core layer; and a second outer layer comprising the second thermoplastic material located on a second side of the core layer opposite the first side; wherein the core thickness is 30% to 75% of a total thickness of the A-B-A structure.

Abstract: In an embodiment, an A-B-A structure, can comprise: a core layer comprising a first thermoplastic material having a first density (Y), wherein the core layer has a core thickness and wherein the core layer comprise at least one of (i) a through plane thermal conductivity of greater than equal to 0.1 W/m K, and (ii) a core layer density (X) that is X?0.8Y; a first outer layer comprising a second thermoplastic material located on a first side of the core layer; and a second outer layer comprising the second thermoplastic material located on a second side of the core layer opposite the first side; wherein the core thickness is 30% to 75% of a total thickness of the A-B-A structure.

Abstract: Various mold apparatuses and methods for forming a polymer with induction heat energy are provided. In one embodiment of the present invention, a mold apparatus for forming polymer includes a mold having a top mold portion and a top mold surface that is magnetic. The bottom mold portion of the mold includes an induction heating unit that is at least partially embedded in the bottom mold portion that provides induction heat energy to the mold. The mold apparatus is constructed and arranged to dissipate greater than about 50% of the induction heat energy in the top mold portion. The induction heating unit of the bottom portion of the mold provides rapid heating to the top mold surface to provide high surface quality polymer parts and a shorter molding cycle time while utilizing less energy.

Abstract: Various mold apparatuses and methods for forming a polymer with induction heat energy are provided. In one embodiment of the present invention, a mold apparatus for forming polymer includes a mold having a top mold portion and a top mold surface that is magnetic. The bottom mold portion of the mold includes an induction heating unit that is at least partially embedded in the bottom mold portion that provides induction heat energy to the mold. The mold apparatus is constructed and arranged to dissipate greater than about 50% of the induction heat energy in the top mold portion. The induction heating unit of the bottom portion of the mold provides rapid heating to the top mold surface to provide high surface quality polymer parts and a shorter molding cycle time while utilizing less energy.

Abstract: Various mold apparatuses and methods for forming a polymer with induction heat energy are provided. In one embodiment of the present invention, a mold apparatus for forming polymer includes a mold having a top mold portion and a top mold surface that is magnetic. The bottom mold portion of the mold includes an induction heating unit that is at least partially embedded in the bottom mold portion that provides induction heat energy to the mold. The mold apparatus is constructed and arranged to dissipate greater than about 50% of the induction heat energy in the top mold portion. The induction heating unit of the bottom portion of the mold provides rapid heating to the top mold surface to provide high surface quality polymer parts and a shorter molding cycle time while utilizing less energy.

Abstract: Various mold apparatuses and methods for forming a polymer with induction heat energy are provided. In one embodiment of the present invention, a mold apparatus for forming polymer includes a mold having a top mold portion and a top mold surface that is magnetic. The bottom mold portion of the mold includes an induction heating unit that is at least partially embedded in the bottom mold portion that provides induction heat energy to the mold. The mold apparatus is constructed and arranged to dissipate greater than about 50% of the induction heat energy in the top mold portion. The induction heating unit of the bottom portion of the mold provides rapid heating the top mold surface to provide high surface quality polymer parts a shorter molding cycle time while utilizing less energy.

Abstract: A composite sheet material that includes at least one porous core layer including a thermoplastic material and from about 20 weight percent to about 80 weight percent fibers based on a total weight of the porous core layer, and at least one skin covering a surface of the core layer. The skin includes at least one of a thermoplastic film, a fiber based scrim, a non-woven fabric, and a woven fabric.