Patents by Inventor Daniel Stritch

Daniel Stritch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture of electroless cobalt deposition compositions for microelectronics applications
    Patent number: 7704306
    Abstract: A method of preparing an aqueous electroless deposition composition for electrolessly depositing Co or a Co alloy onto a substrate in manufacture of microelectronic devices by treating water or an aqueous electroless deposition composition with a deoxygenating treatment to reduce the oxygen concentration.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: April 27, 2010
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Richard Hurtubise, Vincent Paneccasio, Charles Valverde, Daniel Stritch
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7615491
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 10, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7611987
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7611988
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7410899
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: August 12, 2008
    Assignee: Enthone, Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICROELECTRONICS APPLICATIONS
    Publication number: 20080090414
    Abstract: A method of preparing an aqueous electroless deposition composition for electrolessly depositing Co or a Co alloy onto a substrate in manufacture of microelectronic devices by treating water or an aqueous electroless deposition composition with a deoxygenating treatment to reduce the oxygen concentration.
    Type: Application
    Filed: October 16, 2006
    Publication date: April 17, 2008
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Richard Hurtubise, Vincent Paneccasio, Charles Valverde, Daniel Stritch
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070066057
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070062408
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070066058
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070066059
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubies
  • Cobalt self-initiated electroless via fill for stacked memory cells
    Publication number: 20060188659
    Abstract: A method for electrolessly filling a stacked memory cell interconnect feature comprising electroless deposition from a composition comprising Co ions and a reducing agent by bottom-up filling initiated by reduction to Co metal on an electrically conducting bottom of the feature. An electroless deposition composition for electrolessly depositing Co in a high aspect ratio stacked memory cell interconnect feature, the composition comprising water, Co ions, a complexing agent, a buffering agent, a borane-based reducing agent component, and a hypophosphite reducing agent component. There is a concentration ratio of borane-based reducing agent to hypophosphite reducing agent of less than about 0.5.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Richard Hurtubise, Christian Witt, Joseph Abys, Daniel Stritch, Charles Valverde