Abstract: An apparatus and method for on-chip bias measurement of an analog signals on an integrated circuit with a switchable analog-to-digital converter capable of performing testing and other types of processing. Analog signal test locations are selected for testing by a test input selector which is in turn controlled by a controller on an integrated circuit, such as an imager chip. Test locations are connected to one or more analog-to-digital converters through the test input selector. The analog-to-digital converter(s) output a test measurement digital output to either test equipment or an on-chip calibration circuit. Test equipment or on-chip calibration circuits adjusts imager component bias or other operating parameters used in chip or device operation based on output from the analog-to-digital converter(s).

Abstract: An apparatus and method for on-chip bias measurement of an analog signals on an integrated circuit with a switchable analog-to-digital converter capable of performing testing and other types of processing. Analog signal test locations are selected for testing by a test input selector which is in turn controlled by a controller on an integrated circuit, such as an imager chip. Test locations are connected to one or more analog-to-digital converters through the test input selector. The analog-to-digital converter(s) output a test measurement digital output to either test equipment or an on-chip calibration circuit. Test equipment or on-chip calibration circuits adjusts imager component bias or other operating parameters used in chip or device operation based on output from the analog-to-digital converter(s).

Abstract: An apparatus and method for on-chip bias measurement of an analog signals on an integrated circuit with a switchable analog-to-digital converter capable of performing testing and other types of processing. Analog signal test locations are selected for testing by a test input selector which is in turn controlled by a controller on an integrated circuit, such as an imager chip. Test locations are connected to one or more analog-to-digital converters through the test input selector. The analog-to-digital converter(s) output a test measurement digital output to either test equipment or an on-chip calibration circuit. Test equipment or on-chip calibration circuits adjusts imager component bias or other operating parameters used in chip or device operation based on output from the analog-to-digital converter(s).

Abstract: A probe card for production testing of semiconductor imaging die includes a stiffener supported on a bottom side of the probe card. The top of the stiffener is substantially flush with a top surface of the probe card. A light passage through the stiffener features non-reflective surfaces. Surfaces surrounding the light passage are arranged to avoid casting any shadows on the imaging die being tested. The arrangement provides a low profile probe card. A source of light used to illuminate the imaging die through the light passage can be placed close to the imaging device under test, providing few false negatives and more consistent results from wafer to wafer.

Abstract: An apparatus and method for on-chip bias measurement of an analog signals on an integrated circuit with a switchable analog-to-digital converter capable of performing testing and other types of processing. Analog signal test locations are selected for testing by a test input selector which is in turn controlled by a controller on an integrated circuit, such as an imager chip. Test locations are connected to one or more analog-to-digital converters through the test input selector. The analog-to-digital converter(s) output a test measurement digital output to either test equipment or an on-chip calibration circuit. Test equipment or on-chip calibration circuits adjusts imager component bias or other operating parameters used in chip or device operation based on output from the analog-to-digital converter(s).

Abstract: A probe card for production testing of semiconductor imaging die includes a stiffener supported on a bottom side of the probe card. The top of the stiffener is substantially flush with a top surface of the probe card. A light passage through the stiffener features non-reflective surfaces. Surfaces surrounding the light passage are arranged to avoid casting any shadows on the imaging die being tested. The arrangement provides a low profile probe card. A source of light used to illuminate the imaging die through the light passage can be placed close to the imaging device under test, providing few false negatives and more consistent results from wafer to wafer.

Abstract: An apparatus and method for on-chip bias measurement of an analog signals on an integrated circuit with a switchable analog-to-digital converter capable of performing testing and other types of processing. Analog signal test locations are selected for testing by a test input selector which is in turn controlled by a controller on an integrated circuit, such as an imager chip. Test locations are connected to one or more analog-to-digital converters through the test input selector. The analog-to-digital converter(s) output a test measurement digital output to either test equipment or an on-chip calibration circuit. Test equipment or on-chip calibration circuits adjusts imager component bias or other operating parameters used in chip or device operation based on output from the analog-to-digital converter(s).

Abstract: An apparatus and method for on-chip bias measurement of an analog signals on an integrated circuit with a switchable analog-to-digital converter capable of performing testing and other types of processing. Analog signal test locations are selected for testing by a test input selector which is in turn controlled by a controller on an integrated circuit, such as an imager chip. Test locations are connected to one or more analog-to-digital converters through the test input selector. The analog-to-digital converter(s) output a test measurement digital output to either test equipment or an on-chip calibration circuit. Test equipment or on-chip calibration circuits adjusts imager component bias or other operating parameters used in chip or device operation based on output from the analog-to-digital converter(s).