Abstract: Systems and methods for mitigating heat rejection limitations of a thermoelectric module are disclosed. In some embodiments, a method of operating a thermoelectric module includes providing a first amount of power to the thermoelectric module and determining that a temperature of a hot side of the thermoelectric module is above a first threshold. The method also includes, in response to determining that the temperature of the hot side is above the first threshold, providing a second amount of power to the thermoelectric module that is less than the first amount of power. The method also includes determining that the temperature of the hot side of the thermoelectric module is below a second threshold and providing a third amount of power to the thermoelectric module. In some embodiments, this mitigates heat rejection limitations of the thermoelectric module, especially when the hot side of the thermoelectric module is passively cooled.

Abstract: The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.

Abstract: Systems and methods for mitigating heat rejection limitations of a thermoelectric module are disclosed. In some embodiments, a method of operating a thermoelectric module includes providing a first amount of power to the thermoelectric module and determining that a temperature of a hot side of the thermoelectric module is above a first threshold. The method also includes, in response to determining that the temperature of the hot side is above the first threshold, providing a second amount of power to the thermoelectric module that is less than the first amount of power. The method also includes determining that the temperature of the hot side of the thermoelectric module is below a second threshold and providing a third amount of power to the thermoelectric module. In some embodiments, this mitigates heat rejection limitations of the thermoelectric module, especially when the hot side of the thermoelectric module is passively cooled.

Abstract: The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.