Patents by Inventor Daniel T. McCormick
Daniel T. McCormick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11088000Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.Type: GrantFiled: December 10, 2019Date of Patent: August 10, 2021Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Benjamin Schwarz, Changhun Lee, Ping Han Hsieh, Adauto Diaz, Jr., Daniel T. McCormick
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Patent number: 10712525Abstract: A method and apparatus for packaging a MEMS device is disclosed that includes a MEMS die mounting surface, a MEMS device disposed on the mounting surface, and a fluid contained within the package and surrounding at least a portion of the MEMS device. The fluid may be selected to provide certain advantageous features. For example, the fluid may have a selected index of refraction that is matched with a lens index of refraction of the lens, have a viscosity selected to provide a predetermined mechanical damping to the MEMS device, be thermally coupled with the MEMS device and configured to remove heat from the MEMS device. The fluid may also be configured in mechanical cooperation with a spring mounted scanning element, a linear translation actuator, a rotational actuator, a lens, etc. to actuate or apply fluidic pressure to such elements.Type: GrantFiled: March 27, 2015Date of Patent: July 14, 2020Inventors: Albert Ting, Daniel T. McCormick, Michael Rattner
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Publication number: 20200118896Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.Type: ApplicationFiled: December 10, 2019Publication date: April 16, 2020Inventors: Leonard Tedeschi, Benjamin Schwarz, Changhun Lee, Ping Han Hsieh, Adauto Diaz, JR., Daniel T. McCormick
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Patent number: 10515862Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.Type: GrantFiled: April 5, 2017Date of Patent: December 24, 2019Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Benjamin Schwarz, Changhun Lee, Ping Han Hsieh, Adauto Diaz, Daniel T. McCormick
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Publication number: 20180294200Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.Type: ApplicationFiled: April 5, 2017Publication date: October 11, 2018Inventors: Leonard TEDESCHI, Benjamin SCHWARZ, Changhun LEE, Ping Han Hsieh, Adauto DIAZ, Daniel T. McCormick
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Patent number: 9975758Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.Type: GrantFiled: July 13, 2017Date of Patent: May 22, 2018Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Lili Ji, Olivier Joubert, Dmitry Lubomirsky, Philip Allan Kraus, Daniel T. McCormick
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Publication number: 20180057356Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.Type: ApplicationFiled: July 13, 2017Publication date: March 1, 2018Inventors: Leonard Tedeschi, Lili Ji, Olivier Joubert, Dmitry Lubomirsky, Philip Allan Kraus, Daniel T. McCormick
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Patent number: 9725302Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, one or more micro sensors are mounted on wafer processing equipment, and are capable of measuring material deposition and removal rates in real-time. The micro sensors are selectively exposed such that a sensing layer of a micro sensor is protected by a mask layer during active operation of another micro sensor, and the protective mask layer may be removed to expose the sensing layer when the other micro sensor reaches an end-of-life. Other embodiments are also described and claimed.Type: GrantFiled: August 25, 2016Date of Patent: August 8, 2017Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Lili Ji, Olivier Joubert, Dmitry Lubomirsky, Philip Allan Kraus, Daniel T. McCormick
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Publication number: 20150198782Abstract: A method and apparatus for packaging a MEMS device is disclosed that includes a MEMS die mounting surface, a MEMS device disposed on the mounting surface, and a fluid contained within the package and surrounding at least a portion of the MEMS device. The fluid may be selected to provide certain advantageous features. For example, the fluid may have a selected index of refraction that is matched with a lens index of refraction of the lens, have a viscosity selected to provide a predetermined mechanical damping to the MEMS device, be thermally coupled with the MEMS device and configured to remove heat from the MEMS device. The fluid may also be configured in mechanical cooperation with a spring mounted scanning element, a linear translation actuator, a rotational actuator, a lens, etc. to actuate or apply fluidic pressure to such elements.Type: ApplicationFiled: March 27, 2015Publication date: July 16, 2015Inventors: Albert Ting, Daniel T. McCormick, Michael Rattner
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Patent number: 9018724Abstract: A method and apparatus for constructing MEMS devices is provided which employs a low cost molded housing that simultaneously provides precise and accurate alignment, mechanical protection, electrical connections and structural integrity for mounting optical and MEMS components. The package includes a MEMS die mounting surface, an optical component mounting surface and an optical imaging window monolithically fabricated with the MEMS die mounting surface in a predetermined orientation for providing alignment between the MEMS die and optical components. A MEMS adaptor plate is provided to facilitate connections of a MEMS die to external components.Type: GrantFiled: March 28, 2008Date of Patent: April 28, 2015Assignee: AdvancedMEMS LLPInventors: Albert Ting, Daniel T. McCormick, Michael Rattner
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Publication number: 20090039489Abstract: A method and apparatus for constructing MEMS devices is provided which employs a low cost molded housing that simultaneously provides precise and accurate alignment, mechanical protection, electrical connections and structural integrity for mounting optical and MEMS components. The package includes a MEMS die mounting surface, an optical component mounting surface and an optical imaging window monolithically fabricated with the MEMS die mounting surface in a predetermined orientation for providing alignment between the MEMS die and optical components. A MEMS adaptor plate is provided to facilitate connections of a MEMS die to external components.Type: ApplicationFiled: March 28, 2008Publication date: February 12, 2009Inventors: Albert Ting, Daniel T. McCormick, Michael Rattner
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Publication number: 20090043211Abstract: A micro-electromechanical system (MEMS) probe package is provided including a first reflective element receiving a light beam directed into to the probe package and a second reflective element receiving light directed from the first reflective element. The second reflective element directs light in an optical path extending from the probe package. At least one of the reflective elements includes a MEMS mirror. An embodiment of the package is made with a monolithic housing having mounting surfaces formed therein for aligning the first reflective element with the second reflective element. The monolithic housing also includes a mounting surface for aligning at least one lens with at least one of the reflective elements.Type: ApplicationFiled: March 28, 2008Publication date: February 12, 2009Inventors: Albert Ting, Daniel T. McCormick, Michael Rattner