Patents by Inventor Daniel UEDING

Daniel UEDING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SPRAYABLE PRESSURE SENSITIVE ADHESIVE COMPOSITION WITH IMPROVED FLAME RETARDING PROPERTIES
    Publication number: 20260209579
    Abstract: A pressure sensitive adhesive compositions containing; a) At least one styrene block copolymer SC, b) At least one tackifying resin TR, c) A flame retardant system FR including: c1 At least one first organophosphorus compound FR1 having a melting temperature of at or below 100° C., c2) At least one second organophosphorus compound FR2 having a melting temperature of at least 150° C., and d) at least one compatibilizer CO.
    Type: Application
    Filed: March 8, 2024
    Publication date: July 23, 2026
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Andreas GÜNTHER, Daniel UEDING, Claudia ARLT
  • Hot-melt pressure sensitive adhesive composition having improved rheological properties
    Patent number: 11034868
    Abstract: An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100° C., and at least one second tackifying resin having a softening point of equal to or higher than 120° C. Further, a method for bonding substrates together using the adhesive composition.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: June 15, 2021
    Assignee: SIKA TECHNOLOGY
    Inventors: Daniel Ueding, Juan Ramón Vila Ferreira, Thomas Hanhörster
  • HOT-MELT PRESSURE SENSITIVE ADHESIVE COMPOSITION HAVING IMPROVED RHEOLOGICAL PROPERTIES
    Publication number: 20200040236
    Abstract: An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100° C., and at least one second tackifying resin having a softening point of equal to or higher than 120° C. Further, a method for bonding substrates together using the adhesive composition.
    Type: Application
    Filed: May 30, 2018
    Publication date: February 6, 2020
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Daniel UEDING, Juan Ramón VILA FERREIRA, Thomas HANHÖRSTER