Patents by Inventor Daniel VERBUGT

Daniel VERBUGT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10978502
    Abstract: The present invention relates to an image sensor. More in particular, the present invention relates to an image sensor that comprises dose sensing pixels to sense an incident dose of photons. Such dose sensing can be used to trigger an image capturing process. A dose sensing pixel will act as a dose sensing pixel in a dose sensing mode of the sensor in dependence of a signal on a dose select line. The invention proposes a dose select line connecting unit for connecting dose select lines of a first stitching block among adjacent stitching blocks to a respective dose select line of a second stitching block among adjacent stitching blocks to prevent multiple dose sensing pixels in the same column of the matrix of pixels from being selected in the dose sensing mode.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: April 13, 2021
    Assignee: TELEDYNE DALSA B.V.
    Inventors: W. J. de Haan, Daniel Verbugt
  • Patent number: 10825848
    Abstract: The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: November 3, 2020
    Assignee: TELEDYNE DIGITAL IMAGING, INC
    Inventors: Daniel Verbugt, Bryan Delodder
  • Publication number: 20190280028
    Abstract: The present invention relates to an image sensor. More in particular, the present invention relates to an image sensor that comprises dose sensing pixels to sense an incident dose of photons. Such dose sensing can be used to trigger an image capturing process. A dose sensing pixel will act as a dose sensing pixel in a dose sensing mode of the sensor in dependence of a signal on a dose select line. The invention proposes a dose select line connecting unit for connecting dose select lines of a first stitching block among adjacent stitching blocks to a respective dose select line of a second stitching block among adjacent stitching blocks to prevent multiple dose sensing pixels in the same column of the matrix of pixels from being selected in the dose sensing mode.
    Type: Application
    Filed: March 11, 2019
    Publication date: September 12, 2019
    Inventors: W.J. de Haan, Daniel Verbugt
  • Publication number: 20170077152
    Abstract: The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.
    Type: Application
    Filed: September 11, 2015
    Publication date: March 16, 2017
    Inventors: Daniel VERBUGT, Bryan Delodder