Patents by Inventor Daniel W. Perry

Daniel W. Perry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip customization using backside access
    Patent number: 9431298
    Abstract: An integrated circuit, a method for making an integrated circuit product, and methods for customizing an integrated circuit are disclosed. Integrated circuit elements including programmable elements, such as fuses, PROMs, RRAMs, MRAMs, or the like, are formed on the frontside of a substrate. Vias are formed through the substrate from its frontside to its backside to establish conduction paths to at least some of the programmable elements from the backside. A programming stimulus is applied to at least some of the vias from the backside to program at least some of the frontside programmable elements.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: August 30, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Daniel W. Perry, Shiqun Gu
  • Integrated Circuit Chip Customization Using Backside Access
    Publication number: 20120112312
    Abstract: An integrated circuit, a method for making an integrated circuit product, and methods for customizing an integrated circuit are disclosed. Integrated circuit elements including programmable elements, such as fuses, PROMs, RRAMs, MRAMs, or the like, are formed on the frontside of a substrate. Vias are formed through the substrate from its frontside to its backside to establish conduction paths to at least some of the programmable elements from the backside. A programming stimulus is applied to at least some of the vias from the backside to program at least some of the frontside programmable elements.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 10, 2012
    Applicant: QUALCOMM Incorporated
    Inventors: Daniel W. Perry, Shiqun Gu