Patents by Inventor Daniel W. Scheele
Daniel W. Scheele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11769977Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.Type: GrantFiled: November 16, 2020Date of Patent: September 26, 2023Assignee: Hutchinson Technology IncorporatedInventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
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Patent number: 11682876Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.Type: GrantFiled: November 16, 2020Date of Patent: June 20, 2023Assignee: Hutchinson Technology IncorporatedInventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
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Publication number: 20210075176Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.Type: ApplicationFiled: November 16, 2020Publication date: March 11, 2021Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
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Publication number: 20210075175Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.Type: ApplicationFiled: November 16, 2020Publication date: March 11, 2021Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
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Patent number: 10840662Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.Type: GrantFiled: March 31, 2016Date of Patent: November 17, 2020Assignee: Hutchinson Technology IncorporatedInventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
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Publication number: 20170088925Abstract: A method and system for stabilizing properties of shape memory alloy (SMA) wires in an optical image stabilization (OIS) suspension of the type having a first or support assembly and a second or moving assembly coupled with respect to one another by the SMA wires. Embodiments of the method comprise cyclically mechanically straining and de-straining the wires by moving the moving and support assemblies with respect to one another while heat is applied to the wires. The temperature, strain, and de-strain levels are configured to cause the wires to cyclically transition between austenite and martensite phases during the mechanical straining and de-straining.Type: ApplicationFiled: September 29, 2016Publication date: March 30, 2017Inventors: Dean E. Myers, Bryan J. Scheele, Daniel W. Scheele, Peter F. Ladwig, Richard R. Jenneke
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Publication number: 20160294141Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.Type: ApplicationFiled: March 31, 2016Publication date: October 6, 2016Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
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Patent number: 9443547Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.Type: GrantFiled: August 25, 2014Date of Patent: September 13, 2016Assignee: Hutchinson Technology IncorporatedInventors: Bryan J. Scheele, Neal T. Eidenschink, John L. Schumann, Trent A. Johnson, Daniel W. Scheele, Cameron T. Hempel, Scott J. Cray, Kenneth L. Bolster
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Publication number: 20150194176Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.Type: ApplicationFiled: August 25, 2014Publication date: July 9, 2015Inventors: Bryan J. Scheele, Neal T. Eidenschink, John L. Schumann, Trent A. Johnson, Daniel W. Scheele, Cameron T. Hempel, Scott J. Cray, Kenneth L. Bolster
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Patent number: 8834660Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.Type: GrantFiled: January 7, 2014Date of Patent: September 16, 2014Assignee: Hutchinson Technology IncorporatedInventors: Bryan J. Scheele, Neal T. Eidenschink, John L. Schumann, Trent A. Johnson, Daniel W. Scheele, Cameron T. Hempel, Scott J. Cray, Kenneth L. Bolster
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Patent number: 7460897Abstract: A patient interface and a method of installing a patient interface for a spectroscopy kit on a patient. The patient interface includes a butterfly-shaped patient interface with a cap on top of the patient interface and in proximity to an optical head.Type: GrantFiled: April 5, 2007Date of Patent: December 2, 2008Assignee: Hutchinson Technology IncorporatedInventors: Larry D. Flessland, Joseph P. Ortner, Bryan J. Scheele, Daniel W. Scheele