Publication number: 20250183182
Abstract: Various techniques for alleviating (e.g., mitigating or reducing) stresses between glass core materials and electrically conductive materials deposited in through-glass vias (TGVs) and related devices and methods are disclosed. In one aspect, a microelectronic assembly includes a glass core having a first face and a second face opposite the first face, and a TGV extending through the glass core between the first face and the second face, wherein the TGV includes a conductive material and a buffer layer between the conductive material and the glass core, wherein a CTE of the buffer layer is smaller than a CTE of the conductive material.
Type:
Application
Filed:
November 30, 2023
Publication date:
June 5, 2025
Inventors:
Bohan Shan, Mahdi Mohammadighaleni, Joshua Stacey, Ehsan Zamani, Aaditya Candadai, Jacob Vehonsky, Daniel Wandera, Mitchell Page, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Jeremy Ecton, Brandon C. Marin, Onur Ozkan, Vinith Bejugam, Dhruba Pattadar, Amm Hasib, Nicholas Haehn, Makoyi Watson, Sanjay Tharmarajah, Jason M. Gamba, Yuqin Li, Astitva Tripathi, Mohammad Mamunur Rahman, Haifa Hariri, Shayan Kaviani, Logan Myers, Darko Grujicic, Elham Tavakoli, Whitney Bryks, Dilan Seneviratne, Bainye Angoua, Peumie Abeyratne Kuragama, Hongxia Feng, Kyle Jordan Arrington, Bai Nie, Jose Waimin, Ryan Carrazzone, Haobo Chen, Dingying Xu, Ziyin Lin, Yiqun Bai, Xiaoying Guo, Bin Mu, Thomas S. Heaton, Rahul N. Manepalli
Publication number: 20250112163
Abstract: An IC die package includes a substrate comprising glass and a plurality of holes extending through the glass. A via metallization is present within the holes. A liner is between the via metallization and the glass. The liner can comprise a beta-titanium alloy layer, polymer hydrogel layer and an MXene seed layer, an organic material layer and a metal layer, or an organic material layer between first and second metal layers. A polymer layer may be formed by electrodeposition of charged nanoparticles.
Type:
Application
Filed:
September 29, 2023
Publication date:
April 3, 2025
Applicant:
Intel Corporation
Inventors:
Pratyush Mishra, Pratyasha Mohapatra, Srinivas Pietambaram, Whitney Bryks, Mahdi Mohammadighaleni, Joshua Stacey, Travis Palmer, Yosef Kornbluth, Kuang Liu, Astitva Tripathi, Yuqin Li, Rengarajan Shanmugam, Xing Sun, Brian Balch, Darko Grujicic, Jieying Kong, Nicholas Haehn, Jacob Vehonsky, Mitchell Page, Vincent Obiozo Eze, Daniel Wandera, Sameer Paital, Gang Duan
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