Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Abstract: One preferred method for use in making a device structure with use of the resist channel shrinking solution includes the steps of forming a first pedestal portion within a channel of a patterned resist; applying a resist channel shrinking solution comprising a resist channel shrinking film and corrosion inhibitors within the channel of the patterned resist; baking the resist channel shrinking solution over the patterned resist to thereby reduce a width of the channel of the patterned resist; removing the resist channel shrinking solution; and forming a second pedestal portion within the reduced-width channel of the patterned resist. Advantageously, the oxide layer and the corrosion inhibitors of the resist channel shrinking solution reduce corrosion in the pedestal during the act of baking the resist channel shrinking solution.

Abstract: A method of manufacturing a magnetic write head that provides improved pole critical dimension control, such as improved track width control (improved sigma) and improved flare point control. The method involves a combination of several process improvements, such as photolithographically patterning a P2 pole tip defining photoresist frame using a zero print bias and also using a small flash field. The method also involves the use of a non-reactive ion etch to notch the first pole (P1) using the second pole (P2) as a mask.

Abstract: A multi-step process for notching the P1 pole of the write head element of a magnetic head. In a first step following the fabrication of the P2 pole tip, a layer of protective material is deposited on the approximately vertical side surfaces of the P2 pole tip. Thereafter, a first ion milling step, utilizing a species such as argon, is performed to mill through the write gap layer and to notch into the P1 pole layer therebelow. The removal of redeposited material from the side surfaces of the P2 pole tip is thereafter accomplished and the protective material formed on the side surfaces of the P2 pole tip protects the P2 pole tip during the redeposition clean up step. Thereafter, the protective material is removed from the side surfaces of the P2 pole tip, and a second ion milling step is performed to further notch the P1 pole material.

Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Abstract: One preferred method for use in making a device structure with use of the resist channel shrinking solution includes the steps of forming a first pedestal portion within a channel of a patterned resist; applying a resist channel shrinking solution comprising a resist channel shrinking film and corrosion inhibitors within the channel of the patterned resist; baking the resist channel shrinking solution over the patterned resist to thereby reduce a width of the channel of the patterned resist; removing the resist channel shrinking solution; and forming a second pedestal portion within the reduced-width channel of the patterned resist. Advantageously, the oxide layer and the corrosion inhibitors of the resist channel shrinking solution reduce corrosion in the pedestal during the act of baking the resist channel shrinking solution.

Abstract: A magnetic write head and method of manufacture thereof that has a first pole structure having a notched structure configured with a steep shoulder portion and a narrow vertical notch portion extending from the top of the steep shoulder portion. The write head also includes a second pole structure (P2) that has a very narrow width (track width) and that is self aligned with the narrow vertical notch structure of the first pole structure. The write head provides excellent magnetic properties including a very narrow track width and minimal side writing, while avoiding magnetic saturation of the poles.

Abstract: A magnetic disk drive head is disclosed including a write head, which includes a P1 layer having a pedestal portion, a gap layer formed on the P1 layer, and a P2 layer formed on the gap layer. The P1 layer includes a shoulder formation having a neck portion and a beveled portion. Also disclosed is a disk drive having a write head with a P1 layer with shoulder formation, and a method for fabricating a write pole for a magnetic recording head having a P1 layer with shoulder formation.

Abstract: A method and apparatus for integrating a stair notch and a gap bump at a pole tip in a write head is disclosed. A protective plated layer is formed over the bump to prevent the bump form being damaged during formation of the notch at the pole tip. The flux from the second pole outside of the track will be effectively channeled to the first pole piece under the alumina bump.

Abstract: A magnetic head for use in a perpendicular recording system having a novel shield structure that provides exceptional magnetic shielding from extraneous magnetic fields such as from a write coil, shaping layer or return pole of the write head. The shield structure is constructed to have a bottom or leading surface that is generally coplanar with the bottom or leading surface of the shaping layer, but all or a portion of the shield structure is not as thick as the shaping layer so as to have a top surface that does not extend to the same elevation (in a trailing direction) as that of the shaping layer. Making the shields extend to a lower level than the shaping layer improves magnetic performance by reducing flux leakage from the write pole, and also provides manufacturing advantages, such as during the manufacturing of the write pole. These manufacturing advantages include the advantage of having the shields covered with a protective layer of, for example, alumina during the ion milling of the write pole.

Abstract: A method of fabrication of the write head of a perpendicular recording head allows for production of P3 pole tips of width less than 200 nm (200×10?9 meters). The method includes fabricating the P2 flux shaping layer, depositing the P3 layer, depositing a layer of ion-milling resistant material, depositing at least one sacrificial layer, shaping the P3 layer into P3 pole tip, removing the at least one sacrificial layer to leave the P3 pole tip, and encapsulating the P3 pole tip.

Abstract: A method of forming interleaved coils of a write head is disclosed using a combination of non-damascene and damascene processes.

Abstract: A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure.

Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Abstract: A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure.

Abstract: After defining the P2 pole of a magnetic read head, alumina is deposited over it and planarized by CMP, with the portion of the alumina overlaying the ABS region of the P2 pole subsequently being masked by a photoresist layer and with the portions of the alumina overlaying the flare area, back gap region, and center tap regions of the P2 pole not being masked. A reactive ion mill is performed to expose the flare area, back gap region, and center tap regions of the P2 pole by removing the alumina over these portions, so that subsequent steps such as forming a layer of coiled conductors, forming a return pole, and forming stud connections along with removing the respective seed layers can be executed with the ABS region protected by the alumina and with the flare area, back gap region, and center tap region exposed.

Abstract: Methods for creating a write head by forming a bump after the top pole is formed are provided. In one embodiment, a bottom pole is created out of a first layer. A non-magnetic gap material is applied to the surface of the wafer. A top pole is created out of a second layer. After creating the top pole, a bump is created. The bump is used to protect at least a portion of the first layer while etching to create a stray flux absorber.

Abstract: A method for constructing a device such as a magnetoresistive sensor having an extremely narrow width (track width). A photoresist mask is deposited with an edge where an edge of the device is to be located. A layer of material that is susceptible to removal by reactive ion etch (RIEable material) is then deposited over this first mask. The RIEable material is deposited by a conformal deposition method so that it covers the edge of the first mask substantially the same thickness as it covers the other areas. A reactive ion etch (RIE) is then performed to remove horizontally disposed portions of the RIEable layer intact, while leaving at least a portion of the RIEable material at the edge of the sensor intact. This remaining portion of the RIEable material can then be used as a very narrow mask for defining a device such as a magnetoresitive sensor by ion milling.

Abstract: An apparatus for patterning a self-aligned coil using a damascene process is disclosed. Coil pockets are formed in a first insulation layer disposed over a first pole layer. A barrier/seed layer is deposited along walls of the coil pockets in the insulation layer. Copper is formed in the coil pockets and over the insulation layer. The copper is planarized down to the insulation layer. The self-aligned coil process packs more copper into the same coil pocket and relaxes the coil alignment tolerance. Protrusions are prevented because of the more efficient and uniform spacing of the coil to reduce heat buildup in the head during a write.