Patents by Inventor Daniel Wegerif

Daniel Wegerif has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190141882
    Abstract: The present invention relates to an improved process for downstream processing of liquid waste fraction from mammalian, such as animal, waste. More specifically the present invention provides an improved and simplified method for downstream processing of liquid fractions of animal waste in which the nitrogen content is preserved and for inhibiting urease activity in said liquid.
    Type: Application
    Filed: November 14, 2016
    Publication date: May 16, 2019
    Applicant: Waste2Green, LLC
    Inventors: John Shye, Daniel Wegerif, Edward Decker, Jes Thomsen
  • Patent number: 6660963
    Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: December 9, 2003
    Assignee: Applied Photonics, Inc.
    Inventors: Brian Hoekstra, Roger Flannigan, Daniel Wegerif
  • Publication number: 20030024909
    Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
    Type: Application
    Filed: July 16, 2002
    Publication date: February 6, 2003
    Applicant: APPLIED PHOTONICS, INC.
    Inventors: Brian Hoekstra, Roger Flannigan, Daniel Wegerif
  • Patent number: 6489588
    Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: December 3, 2002
    Assignee: Applied Photonics, Inc.
    Inventors: Brian Hoekstra, Roger Flannigan, Daniel Wegerif