Patents by Inventor Daniel William Clark

Daniel William Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230055494
    Abstract: An acoustic diffusion and absorption system can have an ear coupler consisting of a transducer and an ear pad defining a volume surrounding an ear of a user. An insert may be positioned inline between the transducer and the ear of the user to fill at least a portion of the volume defined by the ear pad with the insert having a thickness and a plurality of channels. A first channel of the plurality of channels may continuously extending through the insert to form a waveguide while a second channel of the plurality of channels can have a length that is less than the thickness of the insert to form a resonator.
    Type: Application
    Filed: June 24, 2022
    Publication date: February 23, 2023
    Inventors: Daniel William Clark, Robert Jason Egger
  • Patent number: 11546686
    Abstract: A headphone ear pad system may generate a custom ear pad from a three-dimensional data set of a user. The custom ear pad is attach to a headphone housing and is subsequently used to form an acoustic coupling with an ear of the user and an acoustic driver of the headphone housing. The custom ear pad can have a customized cross-sectional shape and sealing surface to create an optimized acoustic profile for the user.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: January 3, 2023
    Inventors: Daniel William Clark, Robert Jason Egger
  • Publication number: 20220321990
    Abstract: A headphone ear pad system may generate a custom ear pad from a three-dimensional data set of a user. The custom ear pad is attach to a headphone housing and is subsequently used to form an acoustic coupling with an ear of the user and an acoustic driver of the headphone housing. The custom ear pad can have a customized cross-sectional shape and sealing surface to create an optimized acoustic profile for the user.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 6, 2022
    Inventors: Daniel William Clark, Robert Jason Egger
  • Patent number: 11252495
    Abstract: A headphone may employ an ear pad mounted to a housing. Affixing a soft sticky or tacky non-adhesive polymer base to the underside of a headphone ear pad allows easy attachment of ear pads to a headphone with the ability to frequently and non-destructively swap pads, without the weight, bulk and fragility of other pad attachment mechanisms.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: February 15, 2022
    Assignee: Dan Clark Audio, Inc.
    Inventors: Daniel William Clark, Robert Jason Egger
  • Publication number: 20210127199
    Abstract: An earphone can be configured with at least one acoustic driver positioned within an earphone housing. An acoustic driver may be acoustically coupled with an ear canal of a user via two or more airflow pathways that are configured to provide a uniform acoustic impedance from the driver to the user's ear canal.
    Type: Application
    Filed: October 28, 2019
    Publication date: April 29, 2021
    Inventors: Daniel William Clark, Robert Jason Egger
  • Patent number: 10764672
    Abstract: An over-ear headphone system can provide optimal comfort, reliability, and fitment with a headband attached to at least one ear cup. The headband may have a first member and a second member that each extends from a rigid coupler. The rigid coupler can be configured to continuously extend about the periphery of the ear cup so that a gimbal connects the rigid coupler and the ear cup at a lateral position on the ear cup.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: September 1, 2020
    Assignee: MrSpeakers, LLC
    Inventors: Daniel William Clark, Robert Jason Egger
  • Publication number: 20200252709
    Abstract: A headphone may employ an ear pad mounted to a housing. Affixing a soft sticky or tacky non-adhesive polymer base to the underside of a headphone ear pad allows easy attachment of ear pads to a headphone with the ability to frequently and non-destructively swap pads, without the weight, bulk and fragility of other pad attachment mechanisms.
    Type: Application
    Filed: February 4, 2020
    Publication date: August 6, 2020
    Inventors: Daniel William Clark, Robert Jason Egger
  • Patent number: 10631098
    Abstract: A planar magnetic loudspeaker may employ an airflow system having a magnet array separated from a diaphragm. The magnet array can have a plurality of airflow apertures that are arranged in a pattern and each continuously extending through a thickness of the magnet array to increase the signal-to-noise ratio of the planar magnetic loudspeaker.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: April 21, 2020
    Assignee: MrSpeakers, LLC
    Inventors: Daniel William Clark, Robert Jason Egger, Peter Robert Ryan
  • Publication number: 20190208309
    Abstract: An over-ear headphone system can provide optimal comfort, reliability, and fitment with a headband attached to at least one ear cup. The headband may have a first member and a second member that each extends from a rigid coupler. The rigid coupler can be configured to continuously extend about the periphery of the ear cup so that a gimbal connects the rigid coupler and the ear cup at a lateral position on the ear cup.
    Type: Application
    Filed: December 31, 2018
    Publication date: July 4, 2019
    Inventors: Daniel William Clark, Robert Jason Egger
  • Patent number: 10178459
    Abstract: A loudspeaker assembly may be configured with at least one driver disposed between first and second acoustic impedance structures. The first and second impedance structures can be arranged with one or more layers that have similar, or dissimilar, thicknesses. The first and second impedance structures can respectively be configured to maintain symmetric acoustic impedance on opposite sides of the driver during operation of the driver.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: January 8, 2019
    Assignee: MrSpeakers, LLC
    Inventors: Daniel William Clark, Robert Jason Egger
  • Publication number: 20180020292
    Abstract: A planar magnetic loudspeaker may employ an airflow system having a magnet array separated from a diaphragm. The magnet array can have a plurality of airflow apertures that are arranged in a pattern and each continuously extending through a thickness of the magnet array to increase the signal-to-noise ratio of the planar magnetic loudspeaker.
    Type: Application
    Filed: July 13, 2017
    Publication date: January 18, 2018
    Inventors: Daniel William Clark, Robert Jason Egger, Peter Robert Ryan
  • Publication number: 20170264996
    Abstract: A loudspeaker assembly may be configured with at least one driver disposed between first and second acoustic impedance structures. The first and second impedance structures can be arranged with one or more layers that have similar, or dissimilar, thicknesses. The first and second impedance structures can respectively be configured to maintain symmetric acoustic impedance on opposite sides of the driver during operation of the driver.
    Type: Application
    Filed: March 9, 2017
    Publication date: September 14, 2017
    Inventors: Daniel William Clark, Robert Jason Egger
  • Patent number: D855579
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: August 6, 2019
    Assignee: MrSpeakers, LLC
    Inventors: Daniel William Clark, Robert Jason Egger