Patents by Inventor Daniel William Kehoe

Daniel William Kehoe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat pipe assemblies
    Patent number: 9261924
    Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: February 16, 2016
    Assignee: DELL INC.
    Inventors: David William Grunow, Daniel William Kehoe, Matthew B. Mendelow
  • HEAT PIPE ASSEMBLIES
    Publication number: 20150062802
    Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 5, 2015
    Applicant: Dell Products, L.P.
    Inventors: David William Grunow, Daniel William Kehoe, Matthew B. Mendelow