Abstract: A reusable, liner-free labeling system, which allows labels to be wound without the use of a release liner, is described herein. The absence of a liner reduces inventory requirements, roll-changeover time, cost of production, and waste. Additionally, the labeling system described herein provides labels that remove cleanly, which reduces the time required to remove the label and eliminates the necessity of cleaning the substrate after removal. The labeling system provides labels that can be easily reused and reapplied, which can reduce time and costs associated with user labeling error. The labeling system is compatible with labels of all currently available facesheets, regardless of composition or physical characteristics, and allows for large quantity batch printing. The implementation of the labeling system does not require any changes to the pre-existing label printing infrastructure.

Abstract: A reusable, liner-free labeling system, which allows labels to be wound without the use of a release liner, is described herein. The absence of a liner reduces inventory requirements, roll-changeover time, cost of production, and waste. Additionally, the labeling system described herein provides labels that remove cleanly, which reduces the time required to remove the label and eliminates the necessity of cleaning the substrate after removal. The labeling system provides labels that can be easily reused and reapplied, which can reduce time and costs associated with user labeling error. The labeling system is compatible with labels of all currently available facesheets, regardless of composition or physical characteristics, and allows for large quantity batch printing. The implementation of the labeling system does not require any changes to the pre-existing label printing infrastructure.

Abstract: A method of encapsulating a material includes providing a polymer solution including a solvent, and an aqueous solution including a hydrophilic material, mixing the polymer and aqueous solutions, sonicating the mixed solution to obtain a water-in-oil (W/O) emulsion, mixing the water-in-oil emulsion with an oil solution, sonicating the mixed solution to obtain a water-in-oil-in-oil (W/O/O) emulsion, and stirring the water-in-oil-in-oil emulsion in a bath to form a precipitate of encapsulated material and separate the solvent.

Abstract: An apparatus that is used to expand the capabilities of a single board computer (SBC) or a motherboard. The apparatus is made up of a base module that accommodates the SCB or motherboard at an entrance element and provides a first high speed side connecting element and edge connector and a first expansion module that is connected to the base module by an edge connector attaching to the first high speed side connecting element, the expansion module also providing a peripheral component interconnect (PCI) compliant connecting element and a second high speed side connecting element. Additional expansion modules and components can be added to increase capabilities.