Abstract: Described herein is an oral bolus for drying-off cattle, preferably dairy cattle, as well as methods of improving/facilitating the drying-off of cattle, reducing the milk production in pregnant and/or lactating cattle, decreasing milk accumulation in the udder of cattle, increasing the daily lying time of cattle, inducing a mild and temporary metabolic acidosis in cattle, reducing the dry matter intake (DMI) in cattle and/or reducing urine pH in cattle, preferably dairy cattle, including administering to such cattle at least one oral bolus, preferably on the last milking day and/or before dry-off.

Abstract: Described herein is an oral bolus for drying-off cattle, preferably dairy cattle, as well as methods of improving/facilitating the drying-off of cattle, reducing the milk production in pregnant and/or lactating cattle, decreasing milk accumulation in the udder of cattle, increasing the daily lying time of cattle, inducing a mild and temporary metabolic acidosis in cattle, reducing the dry matter intake (DMI) in cattle and/or reducing urine pH in cattle, preferably dairy cattle, including administering to such cattle at least one oral bolus, preferably on the last milking day and/or before dry-off.

Abstract: The invention relates to the use of an oral bolus for drying-off cattle, preferably daily cattle, as well as methods of improving/facilitating the drying-off of cattle, reducing the milk production in pregnant and/or lactating cattle, decreasing milk accumulation in the udder of cattle, increasing the daily lying time of cattle, inducing a mild and temporary metabolic acidosis in cattle, reducing the dry matter intake (DMI) in cattle and/or reducing urine pH in cattle, preferably dairy cattle, comprising administering to such cattle at least one oral bolus, preferably on the last milking day and/or before dry-off.

Abstract: The invention relates to the use of an oral bolus for drying-off cattle, preferably daily cattle, as well as methods of improving/facilitating the drying-off of cattle, reducing the milk production in pregnant and/or lactating cattle, decreasing milk accumulation in the udder of cattle, increasing the daily lying time of cattle, inducing a mild and temporary metabolic acidosis in cattle, reducing the dry matter intake (DMI) in cattle and/or reducing urine pH in cattle, preferably dairy cattle, comprising administering to such cattle at least one oral bolus, preferably on the last milking day and/or before dry-off.

Abstract: The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (10), comprising the following steps: A) arranging at least one semiconductor chip (2) on a carrier (1), B) applying an electrically insulating photoresist (3) to a top side (1a) of the carrier (1) and to the semiconductor chip (2), C) curing the photoresist (3) with a baking step, D) patterning the photoresist (3) by exposure, F) developing the photoresist (3), wherein the photoresist (3) is removed at least from a radiation penetration surface (2b) of the semiconductor chip (2), G) again curing the photoresist (3) with a baking step, and H) applying an electrically conductive contact layer (4) to the photoresist (3), wherein the electrically conductive contact layer (4) is in places at a distance (A) from a marginal surface (3a) of the photoresist (3) which faces towards the semiconductor chip (2), wherein the marginal surface (3a) facing towards the semiconductor chip (2) is

Abstract: The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (10), comprising the following steps: •A) arranging at least one semiconductor chip (2) on a carrier (1), •B) applying an electrically insulating photoresist (3) to a top side (1a) of the carrier (1) and to the semiconductor chip (2), •C) curing the photoresist (3) with a baking step, •D) patterning the photoresist (3) by exposure, •F) developing the photoresist (3), wherein the photoresist (3) is removed at least from a radiation penetration surface (2b) of the semiconductor chip (2), •G) again curing the photoresist (3) with a baking step, and •H) applying an electrically conductive contact layer (4) to the photoresist (3), wherein the electrically conductive contact layer (4) is in places at a distance (A) from a marginal surface (3a) of the photoresist (3) which faces towards the semiconductor chip (2), wherein the marginal surface (3a) facing towards the semiconductor chip