Abstract: Provided herein are metal interconnects that may include a cobalt alloy, a nickel alloy, or nickel. Also provided herein are methods of making metal interconnects. The metal interconnects may include a barrier and/or adhesion layer, a seed layer, a fill material, a cap, or a combination thereof, and at least one of the barrier and/or adhesion layer, the seed layer, the fill material, or the cap may include a cobalt alloy, a nickel alloy, nickel, or a combination thereof.

Abstract: Embodiments of the invention provide methods for electroplating a substrate that substantially reduce or eliminate protrusions and decrease WID thickness variations. The number of protrusions formed on the plating surface is highly dependent upon the electroplating current density. Embodiments of the invention vary the electroplating current waveform by implementing an initial current step sufficient to fill substrate features and a terminal current step sufficient to achieve the specified plating thickness while suppressing protrusions and within die thickness variations.

Abstract: Embodiments of the invention provide methods of reducing electroplating defects by adjusting immersion conditions. For one embodiment, the immersion conditions are adjusted based upon characteristics of the substrate, including feature size. Additionally or alternatively, the immersion conditions may be adjusted based upon aspects of the electroplating process, including motion of the substrate upon immersion. Immersion conditions that may be adjusted in accordance with various embodiments of the invention include entry bias voltage/current, vertical immersion speed, and angle of immersion.

Abstract: An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within die thickness variations to a specified value. For one embodiment of the invention, the leveler and suppressor are increased to reduce within die thickness variations and substantially reduce a plurality of electroplating defects. In such an embodiment the combined concentration of leveler and suppressor is determined to maintain adequate gap fill.

Abstract: An apparatus with a plating container with at least two anodes is described herein.

Abstract: An embodiment of the invention provides a method for reducing electroplating defects by modifying the concentration of components of a high-acid electroplating solution. For one embodiment the suppressor concentration is increased sufficiently to substantially reduce a plurality of electroplating defects while maintaining adequate gap fill. In such an embodiment the concentration of a chloride in the high-acid electroplating solution is determined as low as possible to reduce defects while still sufficient catalyzing the suppressor to maintain adequate gap fill.

Abstract: An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within die thickness variations to a specified value. For one embodiment of the invention, the leveler and suppressor are increased to reduce within die thickness variations and substantially reduce a plurality of electroplating defects. In such an embodiment the combined concentration of leveler and suppressor is determined to maintain adequate gap fill.