Patents by Inventor Daniela Angela Luisa Gatti

Daniela Angela Luisa Gatti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-electro-mechanical device with a movable structure, in particular micromirror, and manufacturing process thereof
    Patent number: 10649202
    Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 12, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventors: Sonia Costantini, Marta Carminati, Daniela Angela Luisa Gatti, Laura Maria Castoldi, Roberto Carminati
  • MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF
    Publication number: 20190121122
    Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 25, 2019
    Applicant: STMicroelectronics S.r.l.
    Inventors: Sonia COSTANTINI, Marta CARMINATI, Daniela Angela Luisa GATTI, Laura Maria CASTOLDI, Roberto CARMINATI
  • Micro-electro-mechanical device with a movable structure, in particular micromirror, and manufacturing process thereof
    Patent number: 10197794
    Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: February 5, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Sonia Costantini, Marta Carminati, Daniela Angela Luisa Gatti, Laura Maria Castoldi, Roberto Carminati
  • MICRO-ELECTRO-MECHANICAL DEVICE WITH A MOVABLE STRUCTURE, IN PARTICULAR MICROMIRROR, AND MANUFACTURING PROCESS THEREOF
    Publication number: 20180180871
    Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.
    Type: Application
    Filed: May 24, 2017
    Publication date: June 28, 2018
    Applicant: STMicroelectronics S.r.l.
    Inventors: Sonia Costantini, Marta Carminati, Daniela Angela Luisa Gatti, Laura Maria Castoldi, Roberto Carminati