Patents by Inventor Daniela Buchman

Daniela Buchman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10368461
    Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 30, 2019
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
  • Publication number: 20190029139
    Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.
    Type: Application
    Filed: September 20, 2018
    Publication date: January 24, 2019
    Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
  • Patent number: 10111356
    Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: October 23, 2018
    Assignee: Oracle International Corporation
    Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
  • Publication number: 20170290190
    Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 5, 2017
    Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman