Patents by Inventor Daniela Staiculescu

Daniela Staiculescu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip design on a coplanar waveguide with a pseudo-coaxial ground bump configuration
    Patent number: 6624521
    Abstract: A flip chip assembly is disclosed that includes a coplanar waveguide launch with a transmission line, and a bump interconnection that includes multiple ground bumps. The transmission line may be a radial transmission line. Similarly, the ground bumps may be arranged in a pseudo-coaxial configuration so as to effect a vertical transition in the flip chip assembly. A method is also disclosed that includes the steps of: providing a coplanar waveguide transmission line launch; providing a chip for attachment to the coplanar waveguide launch; arranging one or more ground bumps on the coplanar waveguide launch; and forming a bump interconnection between the coplanar waveguide launch and the chip. The coplanar waveguide launch provided in this method may include a radial transmission line. The step of arranging the multiple ground bumps may include the step of arranging multiple ground bumps in a pseudo-coaxial configuration.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: September 23, 2003
    Assignee: Georgia Tech Research Corp.
    Inventors: Daniela Staiculescu, Joy Laskar
  • Flip chip assembly and method of producing flip chip assembly
    Publication number: 20030015804
    Abstract: A flip chip assembly is disclosed that includes a coplanar waveguide launch with a transmission line, and a bump interconnection that includes multiple ground bumps. The transmission line maybe a radial transmission line. Similarly, the ground bumps maybe arranged in a pseudo-coaxial configuration so as to effect a vertical transition in the flip chip assembly. A method is also disclosed that includes the steps of: providing a coplanar waveguide transmission line launch; providing a chip for attachment to the coplanar waveguide launch; arranging one or more ground bumps on the coplanar waveguide launch; and forming a bump interconnection between the coplanar waveguide launch and the chip. The coplanar waveguide launch provided in this step may include a radial transmission line. The step of arranging the multiple ground bumps may include the step of arranging multiple ground bumps in a pseudo-coaxial configuration.
    Type: Application
    Filed: July 20, 2001
    Publication date: January 23, 2003
    Inventors: Daniela Staiculescu, Joy Laskar