Patents by Inventor Daniele Memmi

Daniele Memmi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface micromachining process for manufacturing electro-acoustic transducers, particularly ultrasonic transducers, obtained transducers and intermediate products
    Patent number: 7074634
    Abstract: A surface micromachining process for manufacturing Electro-acoustic transducers, particularly ultrasonic transducers, the transducers comprising a silicon semiconductor substrate (1), on an upper surface of which one or more membranes (18) of resilient materials are supported by a structural layer (11) of insulating material, rigidly connected to the semiconductor substrate (1), the resilient material having a Young's modulus not lower than 50 GPa, the membranes (18) being metallised, the transducers including one or more lower electrodes (23, 25), rigidly connected to the semiconductor substrate. The process is characterised in that the structural layer (11) includes silicon monoxide. The invention further relates to an Electro-acoustic transducer, particularly an ultrasonic transducer, characterised in that the insulating material of the structural layer (11) is silicon monoxide.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: July 11, 2006
    Assignees: Consiglio Nazionale Delle Ricerche, Esaote S.p.A., Universita' Degli Studi-Roma Tre
    Inventors: Vittorio Foglietti, Elena Cianci, Daniele Memmi, Giosué Caliano, Massimo Pappalardo
  • Surface micromachining process for manufacturing electro-acoustic transducers, particularly ultrasonic transducers, obtained transducers and intermediate products
    Publication number: 20040180466
    Abstract: This invention relates to a surface micromachining process for manufacturing Electro-acoustic transducers, particularly ultrasonic transducers, said transducers comprising a silicon semiconductor substrate (1), on an upper surface of which one or more membranes (18) of resilient materials are supported by a structural layer (11) of insulating materiel, rigidly connected to said semiconductor substrate (1), said resilient material having a Young's modulus not lower than 50 GPa, said membranes (18) being metallised, said transducers including one or more lower electrodes (23, 25), rigidly connected to said semiconductor substrate (1), the process being characterised in that said structural layer (11) includes silicon monoxide. The invention further relates to an Electro-acoustic transducer, particularly an ultrasonic transducer, characterised in that the insulating material of the structural layer (11) is silicon monoxide.
    Type: Application
    Filed: May 7, 2004
    Publication date: September 16, 2004
    Inventors: Vittorio Foglietti, Elena Cianci, Daniele Memmi, Giosue Caliano, Massimo Pappalardo